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Semiconductor devices. Micro-electromechanical devices-Test method of bonding strength between PDMS and glass 半导体器件 微机电设备
发布日期: 2015-07-31
BS EN 62047-15:2015描述了聚二甲基纤维素之间粘合强度的试验方法 硅氧烷(PDMS)和玻璃。硅基橡胶(PDMS)用于芯片基材料的制造 使用光刻和复制模塑工艺制造的微流控器件。这个 粘接强度的问题主要是在高压应用中,例如在某些情况下 蠕动泵的设计使用了片外压缩空气供应来驱动流体进入 微通道由一层孪生层形成,一层由玻璃和复制品之间的结合形成 模制PDMS和PDMS与PDMS之间的另一个PDMS。此外,如果系统具有 气动微阀,特别是在两个复制品之间,具有相对较高的粘合水平 PDM的模压层变得非常必要。通常会出现泄漏和脱粘 粘结区界面之间的现象,导致不稳定和缺陷 MEMS器件的寿命。本标准规定了混凝土粘结试验的一般程序 PDMS和玻璃芯片。交叉引用:IEC 62047-9EN 62047-9购买本文件时可获得的所有现行修改件均包含在购买本文件中。
BS EN 62047-15:2015 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also, in case of systems having pneumatic microvalves, a relatively high level of bonding particularly between two replica moulded layers of PDMS becomes quite necessary. Usually there is a leakage and debonding phenomena between interface of bonded areas, which causes unstability and shortage of lifetime for MEMS devices. This standard specifies general procedures on bonding test of PDMS and glass chip.Cross References:IEC 62047-9EN 62047-9All current amendments available at time of purchase are included with the purchase of this document.
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发布单位或类别: 英国-英国标准学会
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