BS EN IEC 60384-21:2019适用于固定的未封装表面安装多层膜 电子设备用1级陶瓷介质电容器。这些电容器 具有金属化的连接垫或焊接条，并拟安装在 印刷电路板，或直接安装在混合电路基板上。交叉引用:EN 60063ISO 3:1973IEC 60063IEC 60068-1:2013IEC 61193-2:2007EN 60068-2-58:2015IEC 60068-2-58:2015EN 60068-2-58:2015/A1:2018IEC 60384-1:2016EN 61193-2:2007EN 60384-1:2014IEC 60068-2-58:2015/AMD1:2017EN 60384-14IEC 60417购买本文件时可提供的所有现行修订均包括在购买时。

BS EN IEC 60384-21:2019 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits.Cross References:EN 60063ISO 3:1973IEC 60063IEC 60068-1:2013IEC 61193-2:2007EN 60068-2-58:2015IEC 60068-2-58:2015EN 60068-2-58:2015/A1:2018IEC 60384-1:2016EN 61193-2:2007EN 60384-1:2016EN 60068-1:2014IEC 60068-2-58:2015/AMD1:2017EN 60384-14IEC 60384-14IEC 60417All current amendments available at time of purchase are included with the purchase of this document.