本球形瞬态弯曲试验标准旨在描述表面安装组件的板级互连在弯曲载荷下可承受的最大容许应变。虽然四点单调弯曲试验方法仅适用于简单的平面弯曲，但球形弯曲试验在传统印制板/系统组装、制造和测试操作期间可能出现的最坏弯曲条件下确定了板级互连的应变极限。该方法适用于表面安装的BGA组件，其尺寸大于15.0 mm，位于有机基板一侧，使用传统的回流焊技术连接到印制板上。本文件是与JEDEC合作开发的。

This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC.