现行

GB/T 28858-2012

电子元器件用酚醛包封料
Encapsulating material of phenolic for electronic components

2012-11-05

现行

GB/T 28859-2012

电子元器件用环氧粉末包封料
Encapsulating material of powdered epoxy for electronic components

2012-11-05

现行

SJ/T 11125-1997

电子元器件用环氧系灌封材料
Encapsulation materials of epoxy series for use in electronic components

1997-09-03

现行

SJ/T 11126-1997

电子元件用酚醛系包封材料
Encapsulation materials of phenolic series for use in electronic components

1997-09-02

现行

SJ/T 11124-1997

电子元器件用环氧系粉末包封材料
Encapsulation materials of expoy series powder for use in electronic components

1997-09-02

现行

IEST RP-CC031.3

Method for Characterizing Outgassed Organic Compounds from Cleanroom Materials and Components
无尘室材料和部件排气有机化合物的表征方法

2011-09-01

现行

BS EN 60286-4-2013

Packaging of components for automatic handling-Stick magazines for electronic components encapsulated in packages of different forms
自动搬运组件的包装

2013-11-30

现行

NAS 4120

Heat Sink, Electrical - Electronic Component, Semiconductor Devices, Encapsulating Type, To-5
封装型半导体器件电子元件电散热器To-5

1996-12-01

现行

SJ 20450-1994

封装电子元件用化合物、涂料及瓷料规范
Specification of compound,coating and porcelain for potting electronic components

1994-09-30

现行

IEC 60286-4-2013

Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
自动处理组件的包装 - 第4部分:用于以不同形式包装的电子组件的粘贴杂志

2013-07-26

现行

UNE-EN 60286-4-2000

PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING. PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF FORM E AND G.
用于自动搬运的组件包装 第4部分:封装在E型和G型包装中的电子元件用棒状弹匣

2000-11-21

现行

BS EN 60749-35-2006

Semiconductor devices. Mechanical and climatic test methods-Acoustic microscopy for plastic encapsulated electronic components
半导体器件 机械和气候试验方法

2006-11-30

现行

BS CECC 00808-1996

Harmonized system of quality assessment for electronic components. Guidance document: use and application of plastic encapsulated devices
电子元件质量评定协调体系 指导文件:塑料封装设备的使用和应用

1996-08-15

现行

IEC 60749-35-2006

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
半导体器件 - 机械和气候测试方法第35部分:塑料封装电子元件的声学显微镜

2006-07-18

现行

MIL MIL-P-46847B

PLASTIC MATERIAL, FOAMED POLYURETHANE FOR ENCAPSULATING ELECTRONIC COMPONENTS (SUPERSEDING MIL-P-46847A) (NO S/S DOCUMENT)
塑料材料 用于封装电子元件的泡沫聚氨酯（替代MIL-P-46847A）（无S/S文件）

1984-11-21

现行

MIL MIL-P-46847B Notice 1-Cancellation

PLASTIC MATERIAL, FOAMED POLYURETHANE FOR ENCAPSULATING ELECTRONIC COMPONENTS (SUPERSEDING MIL-P-46847A) (NO S/S DOCUMENT)
塑料材料 用于封装电子部件的泡沫聚氨酯（取代MIL-P-46847A）（无S/S文件）

1990-12-21

现行

GB/T 4937.35-2024

半导体器件 机械和气候试验方法 第35部分：塑封电子元器件的声学显微镜检查
Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components

2024-03-15

现行

BS 10/30232398 DC

BS EN 60286-4. Packaging of components for automatic handling. Part 4. Stick magazines for electronic components encapsulated in packages of form E and G
英国标准EN 60286-4 用于自动搬运的组件包装 第四部分 用于封装在E和G型包装中的电子元件的棒式弹匣

2010-07-21

现行

MIL MIL-C-47150

COMPOUND, COATING, PORCELAIN FOR POTTING ELECTRONIC COMPONENTS (NO S/S DOCUMENT) (SUPERSEDING MPD-9621B)
电子元件封装用陶瓷化合物涂层（无S/S文件）（替代MPD-9621B）

1974-06-07

现行

MIL MIL-C-85447A

CLEANING COMPOUNDS, ELECTRICAL & ELECTRONIC COMPONENTS (NO S/S DOCUMENT) (SUPERSEDING MIL-C-85447)
清洁剂、电气和电子部件（无S/S文件）（取代MIL-C-85447）

1986-09-30