本规范根据使用浸银（IAg）作为印刷电路板表面光洁度的性能标准设定了要求。它适用于化学品供应商、印制板制造商、电子制造服务（EMS）公司和原始设备制造商（OEM）。IAg是一种覆盖在铜上的薄浸没沉积物。它是一种多功能表面抛光剂，适用于焊接。它也可能适用于某些压配合连接和接触面。它有可能适用于铝线键合。 浸没银保护底层铜在其预期保质期内不被氧化。暴露于湿气和空气污染物（如硫和氯）可能会对沉积物的使用寿命产生负面影响。影响范围从沉积物的轻微变色到衬垫完全变黑。正确的包装是一项要求。请注意，在本次修订中，既有单一厚度范围，也有浸没银厚度的上限。

This specification sets requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) companies and original equipment manufacturers (OEM). IAg is a thin immersion deposit over copper. It is a multifunctional surface finish, applicable to soldering. It may also be applicable for some press fit connections and as a contact surface. It has the potential to be suitable for aluminum wire bonding. The immersion silver protects the underlying copper from oxidation over its intended shelf life. Exposure to moisture and air contaminants, such as sulfur and chlorine, may negatively impact the useful life of the deposit. The impact can range from a slight discoloration of the deposit to the pads turning completely black. Proper packaging is a requirement. Note that, in this revision, both a single thickness range is in place and an upper limit for immersion silver thickness has been established.