半导体集成电路 小外形封装引线框架规范
Semiconductor integrated circuits—Specification of leadframes for small outline package

2015-05-15

IEC 60191-2. Proposed new package outline. Small outline package (SOT) 3 -, 5- and 6-Lead SMD (to be published as 182E outline)
IEC 60191-2 提议的新一揽子计划大纲 小型封装（SOT）3芯、5芯和6芯SMD（将作为182E outline出版）

2006-02-23

半导体集成电路 塑料四面引线扁平封装引线框架规范
Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package

2015-05-15

半导体集成电路 塑料有引线片式载体封装引线框架规范
Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package

2015-05-15

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化

2010-12-31

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化

2010-12-31

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化第6-21部分:表面贴装半导体器件封装外形图的一般规则 - 小外形封装（sop）封装尺寸的测量方法

2010-08-30

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化 - 第6-20部分:表面贴装半导体器件封装外形图的一般规则 - 小型J型引线封装（Soj）封装尺寸测量方法

2010-08-30

BS EN 60191-6-21. Mechanical standardization of semiconductor devices. Part 6-21. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
英国标准EN 60191-6-21 半导体器件的机械标准化 第6-21部分 表面安装半导体器件封装外形图绘制的一般规则 小外形包装的包装尺寸测量方法（SOP）

2008-12-01

BS EN 60191-6-20. Mechanical standardization of semiconductor devices. Part 6-20. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
英国标准EN 60191-6-20 半导体器件的机械标准化 第6-20部分 表面安装半导体器件封装外形图绘制的一般规则 小外形J形引线封装（SOJ）的封装尺寸测量方法

2008-12-01

Draft Document - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)
文件草案.半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小型封装外形尺寸的测量方法（SOP）（IEC 47D/733/CD:2008）

2009-02-01

Small, General Purpose Packaged Equipment Instrumentation Specification
小型通用成套设备仪表规范

2017-08-01

Draft Document - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/732/CD:2008)
文件草案.半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制的一般规则.小外形J引线封装（SOJ）的封装尺寸测量方法（IEC 47D/732/CD:2008）

2009-02-01

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小型封装外形尺寸的测量方法（SOP）（IEC 60191-6-21-2010）；德文版EN 60191-6-21:2010

2011-03-01

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制的一般规则.小外形J引线封装（SOJ）封装尺寸的测量方法（IEC 60191-6-20-2010）；德文版EN 60191-6-2

2011-03-01

Electronic Entry Data Sheet for Small, General Purpose Packaged Equipment Instrumentation Specification
小型通用成套设备仪表规范电子输入数据表

2017-08-01

Electronic Entry Data Sheet for Small, General Purpose Packaged Equipment Instrumentation Specification
小型通用成套设备仪表规范电子输入数据表

2017-08-01

DETAIL SPECIFICATION FOR 8-BYTE, 144 POSITION SMALL OUTLINE DUAL IN-LINE MEMORY MODULE (SO DIMM) SOCKETS, 0.8 MM PITCH, RIGHT ANGLE, SURFACE MOUNT
8字节144位小型外框双列直插式存储模块（SO DIMM）表面安装直角0.8mm间距插座详细规范

1998-04-24

Standard Specification for Marketing, Packaging, and Labeling Adult Magnet Sets Containing Small, Loose, Powerful Magnets (with a Flux Index ≥50 kG² mm²)
含有小的、松散的、强大的磁铁（具有通量指数）的成人磁铁组的营销、包装和标签的标准规范≥50 千克^{2 毫米2）}

2021-02-15