现行

BS EN 62047-3-2006

Semiconductor devices. Micro-electromechanical devices-Thin film standard test piece for tensile testing
半导体器件 微机电设备

2006-11-30

现行

BS EN 62047-22-2014

Semiconductor devices. Micro-electromechanical devices-Electromechanical tensile test method for conductive thin films on flexible substrates
半导体器件 微机电设备

2014-10-31

现行

BS EN 62047-20-2014

Semiconductor devices. Micro-electromechanical devices-Gyroscopes
半导体器件 微机电设备

2014-10-31

现行

BS IEC 62047-40-2021

Semiconductor devices. Micro-electromechanical devices-Test methods of micro-electromechanical inertial shock switch threshold
半导体器件 微机电设备

2021-09-14

现行

IEC 62047-2-2006

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
半导体器件 - 微机电器件 - 第2部分:薄膜材料的拉伸测试方法

2006-08-15

现行

IEC 62047-3-2006

Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
半导体器件 - 微机电器件 - 第3部分:薄膜标准试件用于拉伸试验

2006-08-15

现行

IEC 62047-22-2014

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
半导体器件微机电器件第22部分:柔性衬底上导电薄膜的机电拉伸试验方法

2014-06-19

现行

BS EN 62047-1-2016

Semiconductor devices. Micro-electromechanical devices-Terms and definitions
半导体器件 微机电设备

2016-04-30

现行

BS EN 62047-19-2013

Semiconductor devices. Micro-electromechanical devices-Electronic compasses
半导体器件 微机电设备

2013-10-31

现行

BS EN 62047-10-2011

Semiconductor devices. Micro-electromechanical devices-Micro-pillar compression test for MEMS materials
半导体器件 微机电设备

2011-09-30

现行

BS EN 62047-8-2011

Semiconductor devices. Micro-electromechanical devices-Strip bending test method for tensile property measurement of thin films
半导体器件 微机电设备

2011-06-30

现行

IEC 62047-40-2021

Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
半导体器件.微机电器件.第40部分:微机电惯性冲击开关阈值的试验方法

2021-09-03

现行

IEC 62047-20-2014

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
半导体器件微机电器件第20部分:陀螺仪

2014-06-26

现行

BS EN 62047-4-2010

Semiconductor devices. Micro-electromechanical devices-Generic specification for MEMS
半导体器件 微机电设备

2010-11-30

现行

BS EN 62047-5-2011

Semiconductor devices. Micro-electromechanical devices-RF MEMS switches
半导体器件 微机电设备

2013-04-30

现行

GB/T 32817-2016

半导体器件 微机电器件 MEMS总规范
Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS

2016-08-29

现行

IEC 62047-10-2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
半导体器件 - 微机电器件 - 第10部分:MEMS材料的微柱压缩测试

2011-07-26

现行

BS IEC 62047-33-2019

Semiconductor devices. Micro-electromechanical devices-MEMS piezoresistive pressure-sensitive device
半导体器件 微机电设备

2019-04-18

现行

BS IEC 62047-35-2019

Semiconductor devices. Micro-electromechanical devices-Test method of electrical characteristics under bending deformation for flexible electromechanical devices
半导体器件 微机电设备

2021-04-20

现行

IEC 62047-8-2011

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
半导体器件 - 微机电器件 - 第8部分:用于薄膜拉伸性能测量的带钢弯曲试验方法

2011-03-14