IPC-2221B是IPC-2220系列中所有文件的基础设计标准。它规定了印制板和其他形式的组件安装或互连结构（无论是单面、双面还是多层）设计的一般要求。修订版B的许多更新包括导体特性、表面光洁度、通孔保护、电路板电气测试、介电性能、电路板外壳、热应力、合规引脚、面板化以及内外箔厚度的新标准。附录A提供了用于批量验收和质量一致性测试的新试样设计。

IPC-2221B is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision B are new criteria for conductor characteristics, surface finishes, via protection, board electrical test, dielectric properties, board housings, thermal stress, compliant pins, panelization and internal and external foil thicknesses. Appendix A provides new test coupon designs used for lot acceptance and quality conformance testing.