Draft Document - Endurance test methods for die attach materials applied to power electronics devices - Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices (IEC 91/1660/CD:2020); Text in German and Engli
文件草案——电力电子设备用芯片连接材料的耐久性试验方法——第2部分:离散型电力电子设备用芯片连接材料的温度循环试验方法和可靠性性能指标(IEC 91/1660/CD:2020);德语和英语文本