现行

GB/T 4724-2017

印制电路用覆铜箔复合基层压板
Composite base copper clad laminated sheets for printed circuits

2017-07-31

现行

GB/T 36476-2018

印制电路用金属基覆铜箔层压板通用规范
General specification for metal base copper-clad laminates for printed circuits

2018-06-07

现行

GB/T 13555-2017

挠性印制电路用聚酰亚胺薄膜覆铜板
Copper-clad polyimide film laminates for flexible printed circuits

2017-12-29

现行

GB/T 13556-2017

挠性印制电路用聚酯薄膜覆铜板
Copper-clad polyester film laminates for flexible printed circuits

2017-12-29

现行

GB/T 4721-2021

印制电路用刚性覆铜箔层压板通用规则
General rules for rigid copper clad laminates for printed circuits

2021-11-26

现行

GB/T 4722-2017

印制电路用刚性覆铜箔层压板试验方法
Test methods for rigid copper clad laminates for printed circuits board

2017-05-31

现行

GB/T 4723-2017

印制电路用覆铜箔酚醛纸层压板
Phenolic celluloss paper copper clad laminated sheets for printed circuit

2017-07-31

现行

UNE 20620-4-1980

METAL-CLAD BASE MATERIALS FOR PRINTED CIRCUITS. COPPER FOIL
印制电路用金属包覆基材 铜箔

1980-12-15

现行

GB/T 16315-2017

印制电路用覆铜箔聚酰亚胺玻纤布层压板
Polymide woven glass fabric copper clad laminated sheets for printed circuits

2017-07-31

现行

GB/T 4725-2022

印制电路用覆铜箔环氧玻纤布层压板
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits

2022-03-09

现行

JIS C 6482-1997

Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
印制线路板用覆铜层压板纸基环氧树脂

1997-01-01

现行

BS 4584-13-1977

Specification for metal-clad base materials for printed circuits-Silicone woven glass fabric copper-clad laminated sheet Si-GC-Cu-13
印制电路用金属覆层基材规范 硅机织玻璃纤维覆铜层压板Si-GC-Cu-13

1977-11-30

现行

SJ/T 11725-2018

印制电路用导热型覆铜箔环氧复合基层压板
Thermal conduction epoxy composites material copper-clad laminated sheets for printed circuits board

2018-04-30

现行

JIS C 6483-1997

Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin
印制线路板用覆铜层压板合成纤维织物基环氧树脂

1997-01-01

现行

JIS C 6490-1998

Base materials for printed circuits -- Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的聚酰亚胺玻璃纤维织物覆铜层压板（垂直燃烧试验）

1998-01-01

现行

BS 4584-103.2-1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for copper foil for use in the manufacture of copper-clad base materials
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 覆铜基材制造用铜箔规范

1990-02-28

现行

JIS C 6493-1999

Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
印制电路用基材多层印制板制造用规定可燃性的薄型聚酰亚胺编织玻璃纤维覆铜层压板

1999-01-01

现行

BS 4584-5-1972

Specification for metal-clad base materials for printed circuits-Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality: PF-CP-Cu-5
印制电路用金属覆层基材规范 中等电气质量酚醛纤维素纸覆铜层压板:PF-CP-Cu-5

1972-07-28

现行

BS EN 60249-2-3-1994

Specifications-Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-04-15

现行

JIS C 6489-1999

Base materials for printed circuits -- Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的环氧无纺布/玻璃纤维增强覆铜层压板（垂直燃烧试验）

1999-01-01