现行

IEC 60747-15-2024 RLV

Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
半导体器件第15部分:分立器件隔离功率半导体器件

2024-10-22

现行

IEC 60747-15-2024

Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
半导体器件第15部分:分立器件隔离功率半导体器件

2024-10-22

现行

BS 07/30162213 DC

BS EN 60747-15. Semiconductor devices. Discrete devices Part 15. Isolated power semiconductor devices
英国标准EN 60747-15 半导体器件 分立器件第15部分 隔离功率半导体器件

2007-02-07

现行

DIN EN 60747-6-DRAFT

Draft Document - Semiconductor devices - Discrete devices - Part 6: Thyristors (IEC 47E/444/CD:2012)
文件草案-半导体器件-分立器件-第6部分:晶闸管（IEC 47E/444/CD:2012）

2013-01-01

现行

DIN EN 60747-5-7-DRAFT

Draft Document - Semiconductor devices - Discrete devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors (IEC 47E/420/CD:2011)
文件草案-半导体器件-分立器件-第5-7部分:光电子器件-光电二极管和光电晶体管（IEC 47E/420/CD:2011）

2011-12-01

现行

DIN IEC 60747-7-DRAFT

Draft Document - Semiconductor devices - Discrete devices - Part 7: Bipolar transistors (BTRs) (IEC 47E/324/CD:2007)
文件草案.半导体器件.分立器件.第7部分:双极晶体管（BTR）（IEC 47E/324/CD:2007）

2007-09-01

现行

DIN IEC 60747-8-DRAFT

Draft Document - Semiconductor devices - Discrete devices - Part 8: Field-effect transistors (IEC 47E/320/CD:2007)
文件草案.半导体器件.分立器件.第8部分:场效应晶体管（IEC 47E/320/CD:2007）

2007-06-01

现行

DIN IEC 60747-4-DRAFT

Draft Document - Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors (IEC 47E/265/CD:2004)
文件草案.半导体器件.分立器件.第4部分:微波二极管和晶体管（IEC 47E/265/CD:2004）

2005-01-01

现行

DIN IEC 60747-14-4-DRAFT

Draft Document - Discrete semiconductor devices - Part 14-4: Semiconductor accelerometers (IEC 47E/220/CD:2002)
文件草案分立半导体器件第14-4部分:半导体加速计（IEC 47E/220/CD:2002）

2002-09-01

现行

DIN EN 60747-5-6-DRAFT

Draft Document - Semiconductor devices - Discrete devices - Part 5-6: Optoelectronic devices - Light emitting diodes (IEC 47E/418/CD:2011)
文件草案-半导体器件-分立器件-第5-6部分:光电子器件-发光二极管（IEC 47E/418/CD:2011）

2011-12-01

现行

DIN VDE 0884-2/A2-DRAFT

Draft Document - Changes for IEC 60747-5-2:1997 + A1:2002; Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices; Essential ratings and characteristics
文件草案——IEC 60747-5-2:1997+A1:2002的变更；分立半导体器件和集成电路.第5-2部分:光电子器件；基本评级和特征

2002-11-01

现行

DIN IEC 62047-5-DRAFT

Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS Switches (IEC 47/1928/CD:2007)
文件草稿.半导体器件.微机电器件.第5部分:RF MEMS开关（IEC 47/1928/CD:2007）

2008-02-01

现行

DIN IEC 62047-4-DRAFT

Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 47/1857/CD:2006)
文件草稿.半导体器件.微机电器件.第4部分:MEMS总规范（IEC 47/1857/CD:2006）

2006-09-01

现行

DIN EN 62830-1-DRAFT

Draft Document - Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting (IEC 47/2189/CD:2014)
文件草案-半导体器件-能量收集和发电用半导体器件-第1部分:基于振动的压电能量收集（IEC 47/2189/CD:2014）

2014-05-01

现行

DIN EN 62830-3-DRAFT

Draft Document - Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting (IEC 47/2198/CD:2014)
文件草案-半导体器件-能量收集和发电用半导体器件-第3部分:基于振动的电磁能量收集（IEC 47/2198/CD:2014）

2014-09-01

现行

DIN EN 62880-1-DRAFT

Draft Document - Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method (IEC 47/2191/CD:2014)
文件草稿.半导体器件.半导体器件的晶圆级可靠性.第1部分:铜应力迁移试验方法（IEC 47/2191/CD:2014）

2014-08-01

现行

DIN IEC 62047-7-DRAFT

Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS FBAR Filter & Duplexer (IEC 47/1969/CD:2008)
文件草稿.半导体器件.微机电器件.第7部分:MEMS FBAR滤波器和双工器（IEC 47/1969/CD:2008）

2008-09-01

现行

DIN EN 62830-2-DRAFT

Draft Document - Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting (IEC 47/2190/CD:2014)
文件草案-半导体器件-能量收集和发电用半导体器件-第2部分:基于热电能的热电能量收集（IEC 47/2190/CD:2014）

2014-05-01

现行

DIN IEC 60191-4-DRAFT

Draft Document - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/769/CD:2010)
文件草稿.半导体器件的机械标准化.第4部分:半导体器件封装外形的编码系统和分类形式（IEC 47D/769/CD:2010）

2010-07-01

现行

DIN IEC 60747-14-5-DRAFT

Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
文件草稿-半导体器件-第14-5部分:半导体传感器-PN结半导体温度传感器（IEC 47E/353/CD:2007）

2008-03-01