IEC 60068-2-69:2017概述了测试Te/Tc、焊料槽润湿平衡法和焊料球润湿平衡法，以定量确定端子的可焊性。通过这些方法获得的数据不打算用作通过-失败目的的绝对定量数据。 这些程序描述了焊料槽润湿平衡法和焊料球润湿平衡法。它们适用于具有金属端子和金属化焊盘的元件和印刷电路板。 本文件提供了含铅和不含铅（Pb）焊料合金的测量程序。 与上一版相比，此版本包括以下重大技术变更: -集成IEC 60068-2-54； -包括印制板的测试；-包括新的组件类型，并更新整个组件列表的测试参数； -纳入新的压力计R&R测试方案，以确保正确校准相应的润湿天平设备。

IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.
This document provides the measurement procedures for solder alloys both with and without lead (Pb).
This edition includes the following significant technical changes with respect to the previous edition:
- integration of IEC 60068-2-54;
- inclusion of tests of printed boards;
- inclusion of new component types, and updating test parameters for the whole component list;
- inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.