电力半导体器件用型材散热体外形尺寸

1999-08-06

半导体发光器件外形尺寸
Outline demensions for semiconductor light-emitting devices

1986-02-18

半导体分立器件外形尺寸
Dimensions of outlines for semiconductor discrete devices

1987-03-27

半导体集成电路外形尺寸
Outline dimensions of semiconductor integrated circuits

2021-03-09

Draft Document - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)
文件草案.半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小型封装外形尺寸的测量方法（SOP）（IEC 47D/733/CD:2008）

2009-02-01

Compression and mechanical connectors for power cables with copper or alluminium conductors. Compression terminal lugs for power cables to fit equipment up to and including 1 kV. Overall dimensions.
铜或铝导体电力电缆用压缩和机械连接器 用于安装1kV及以下设备的电力电缆压缩终端接线片 外形尺寸

2003-02-28

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小型封装外形尺寸的测量方法（SOP）（IEC 60191-6-21-2010）；德文版EN 60191-6-21:2010

2011-03-01