现行

MIL MIL-STD-202/208

Method 208, Solderability
方法208 可焊性

2015-04-18

现行

AS/NZS 1301.208s-2007

Methods of test for pulp and paper, Method 208s: Physical testing of pulp handsheets
纸浆和纸张的试验方法 方法208s:纸浆手抄纸的物理试验

2007-04-04

现行

GB/T 28770-2012

软钎料试验方法
Test methods for solders

2012-11-05

现行

ASTM B678-23

Standard Test Method for Solderability of Metallic-Coated Products
金属涂层产品可焊性的标准试验方法

2023-11-01

现行

GB/T 16745-1997

金属覆盖层产品钎焊性的标准试验方法
Standard test method for solderability of metallic-coated products

1997-03-04

现行

BS EN ISO 9455-10-2012

Soft soldering fluxes. Test methods-Flux efficacy test, solder spread method
软钎焊剂 测试方法

2012-11-30

现行

SJ/T 10146-1991

焊槽法可焊性测试仪技术条件
Specification for solderability test instrument by solder bath method

1991-04-02

现行

GB/T 4909.12-2009

裸电线试验方法 第12部分：镀层可焊性试验-焊球法
Test methods for bare wires - Part 12: Solderability test of coating - Solder globule method

2009-03-19

现行

JIS Z 3198-5-2003

Test methods for lead-free solders -- Part 5: Methods for tensile tests and shear tests on solder joints
无铅焊料试验方法第5部分:焊点拉伸试验和剪切试验方法

2003-01-01

现行

KS B ISO 9455-10

연납땜 용제의 시험방법 —제10부: 용제의 유효성 시험, 납땜 퍼짐 방법
软焊剂 - 试验方法 - 第10部分:助焊剂功效试验 焊点扩散法

2021-01-26

现行

GB/T 38265.10-2019

软钎剂试验方法 第10部分：软钎剂润湿性能 铺展试验方法
Test methods for soft soldering fluxes—Part 10:Flux efficacy test—Solder spread method

2019-12-31

现行

ISO 9455-10-2012

Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method
软钎焊剂——试验方法第10部分:助焊剂功效试验、焊料扩散法

2012-09-17

现行

BS EN 60512-12-1-2006

Connectors for electronic equipment. Tests and measurements-Soldering tests-Test 12a. Solderability, wetting, solder bath method
电子设备用连接器 测试和测量

2006-06-30

现行

BS EN 60512-12-2-2006

Connectors for electronic equipment. Tests and measurements-Soldering tests. Test 12b. Solderability, wetting, soldering iron method
电子设备用连接器 测试和测量 焊接测试 测试12b 可焊性、润湿性、烙铁法

2007-03-30

现行

BS EN 60512-12-4-2006

Connectors for electronic equipment. Tests and measurements-Soldering tests. Test 12d. Resistance to soldering heat, solder bath method
电子设备用连接器 测试和测量 焊接测试 测试12d 耐焊接热 锡槽法

2007-03-12

现行

BS EN 60512-12-5-2006

Connectors for electronic equipment. Tests and measurements-Soldering tests. Test 12e. Resistance to soldering heat, soldering iron method
电子设备用连接器 测试和测量 焊接测试 测试12e 耐焊接热 烙铁法

2006-04-28

现行

BS EN 60512-12-7-2001

Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Soldering tests-Test 12g. Solderability, wetting balance method-Section 7: Test 12g: Solderability, wetting balance method
电子设备用机电元件 基本测试程序和测量方法 焊接试验

2001-08-15

现行

JIS Z 3198-6-2003

Test methods for lead-free solders -- Part 6: Methods for 45�pull test of solder joints on QFP lead
无铅焊料试验方法第6部分:QFP铅焊点45°拉力试验方法

2003-01-01

现行

KS C 2509(2017 Confirm)

납땜용 수지계 플럭스 시험 방법
测试方法树脂型助焊剂

2002-11-30

现行

SJ/T 10144-1991

焊球法可焊性测试仪技术条件
Specification for solderability test instrument by globule method

1991-04-02