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现行 IEC 62148-22:2023
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Fibre optic active components and devices - Package and interface standards - Part 22: 25 Gbit/s directly modulated laser packages with temperature control unit 光纤有源元件和器件.封装和接口标准.第22部分:带温度控制单元的25Gbit/s直接调制激光封装
发布日期: 2023-02-15
IEC 62148-22:2023定义了用于光通信和光数据传输应用的直接调制激光(DML)设备的物理尺寸和接口规范。本文件旨在充分规定DML设备的物理要求,以便在印刷电路板和任何面板安装要求上实现符合本文件要求的激光设备或发射器的机械互换性。
IEC 62148-22: 2023 defines the physical dimensions and interface specifications for directly modulated laser (DML) devices used in optical telecommunication and optical data transmission applications. The intent of this document is to adequately specify the physical requirements for DML devices so as to enable mechanical interchangeability of laser devices or transmitters complying with this document both at the printed circuit board and for any panel-mounting requirements.
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归口单位: TC 86/SC 86C
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