首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 IPC 2316
到馆提醒
收藏跟踪
购买正版
Design Guide for Embedded Passive Device Printed Boards 嵌入式无源器件印制板设计指南
发布日期: 2007-03-01
IPC-2316为印制板用户和设计师提供了将成型和放置的嵌入式无源元件整合到其应用中所需的信息。本文介绍了嵌入式无源技术的历史,以及嵌入式电阻器、电容器和电感器的全部内容。此外,它还帮助用户了解嵌入式组件材料的一些物理、电气和热特性,以便其设计能够实现最大的稳定性和性能。
IPC-2316 offers printed board users and designers the necessary information for incorporating formed and placed embedded passive components into their applications. The history of embedded passive technologies is given along with full coverage of embedded resistors, capacitors and inductors. In addition, it also assists the user in understanding some of the physical, electrical and thermal characteristics of the embedded component materials so that their designs can achieve maximum stability and performance.
分类信息
关联关系
研制信息
相似标准/计划/法规
现行
BS DD IEC/PAS 62326-14-2010
Printed boards-Device embedded substrate. Terminology / reliability / design guide
印制板 设备嵌入基板 术语/可靠性/设计指南
2010-11-30
现行
SJ 21294-2018
埋入元件印制根性能规范
Performace specification for embedded passive devices printed circuit boards
2018-01-18
现行
KS C IEC 62326-14(2017 Confirm)
인쇄회로기판-제14부:부품내장기판-용어/신뢰성/설계안내
印制板第14部分:器件嵌入基板术语/可靠性/设计指南
2012-11-19
现行
KS C IEC 62326-14(2022 Confirm)
인쇄회로기판-제14부:부품내장기판-용어/신뢰성/설계안내
印制板-第14部分:器件嵌入基板-术语/可靠性/设计指南
2012-11-19
现行
IPC 4821
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
刚性和多层印制板用嵌入式无源器件电容器材料规范
2006-05-01
现行
IPC 4811
Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
刚性和多层印制板用嵌入式无源器件电阻器材料规范
2008-05-01
现行
BS 6221-23-1991
Printed wiring boards-Guide for the design and use of printed wiring boards: surface mounted devices
印刷线路板 印刷线路板的设计和使用指南:表面安装设备
1991-02-28
现行
DIN IEC/TS 62326-19-DRAFT
Draft Document - Printed boards - Part 19: Device Embedded Substrate - Design Guide (IEC 91/1084/CD:2013)
文件草稿印制板第19部分:设备嵌入式基板设计指南(IEC 91/1084/CD:2013)
2013-08-01
现行
DIN EN 62326-15-DRAFT
Draft Document - Printed boards - Device Embedded Substrate - General electrical test guide for device embedded substrate with active devices, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages (IEC 91/995/CD:2011)
文件草案——印制板——设备嵌入式基板——带有源器件、无源元件(电容器、电阻器、电感器等)、集成无源器件(IPD)和分立封装的设备嵌入式基板的通用电气试验指南(IEC 91/995/CD:2011)
2012-01-01
现行
BS 11/30252443 DC
BS EN 62326-15. Printed boards. Device Embedded Substrate. General elect rical test guide for device embedded substrate with active devices, pass ive components (capacitor, resistor, inductor, etc), integratedpassive d evice (IPD), and discrete packages
英国标准EN 62326-15 印制板 设备嵌入基板 带有有源器件、通电元件(电容器、电阻器、电感器等)、集成无源器件(IPD)和分立封装的器件嵌入式基板的通用电气测试指南
2011-08-30