IEC 60749-39:2021可用作:；IEC 60749-39:2021 RLV；其中包含国际标准及其红线版本，显示了与前一版本相比技术内容的所有变化。IEC 60749-39:2021详细说明了用于半导体元件封装的有机材料中水分扩散率和水溶性特征特性的测量程序。这两种材料特性是塑料封装半导体在暴露于潮湿环境和经受高温后的有效可靠性性能的重要参数- 温度焊接回流焊。本版本包括与前一版本相比的以下重大技术变更: -“干重”测定的更新程序。

IEC 60749-39:2021 is available as;IEC 60749-39:2021 RLV;which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-39:2021 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. This edition includes the following significant technical changes with respect to the previous edition: - updated procedure for "dry weight" determination.