IEC TR 61191-8:2021（E）给出了处理汽车电子设备用印制板组件表面安装焊点空洞的指南。本技术报告专门关注封装电子或机电元件与印制板（PBs）连接的焊点中的空隙。不考虑其他焊点中的空隙（例如，电子元件内硅芯片和基板之间的接缝、通孔元件的焊点等）。讨论了焊点中出现空洞的技术背景、空洞对印制板组件可靠性和功能性的潜在影响、使用X射线检查对样品和批量生产中的空洞水平的调查，以及不同类型焊点中的典型空洞水平。 还提出了在批量生产中控制排尿的建议。附录A收集了部件的典型排泄水平和可接受性建议。

IEC TR 61191-8:2021(E) gives guidelines for dealing with voiding in surface-mount solder joints of printed board assemblies for use in automotive electronics. This technical report focuses exclusively on voids in solder joints connecting packaged electronic or electromechanical components with printed boards (PBs). Voids in other solder joints (e.g. in a joint between a silicon die and a substrate within an electronic component, solder joints of through-hole components, etc.) are not considered. The technical background for the occurrence of voids in solder joints, the potential impact of voiding on printed board assembly reliability and functionality, the investigation of voiding levels in sample- and series-production by use of X？ray inspection as well as typical voiding levels in different types of solder joints are discussed. Recommendations for the control of voiding in series production are also given. Annex A collects typical voiding levels of components and recommendations for acceptability.