IPC-1602标准提供了保护印制板免受污染、物理损坏、可焊性退化和吸湿的要求。考虑到包装材料类型和方法、生产环境、产品的搬运和运输，以及建立用于去除水分的烘焙轮廓。IPC-1602现在提供了可在采购文件中调用的要求。IPC-1602标准扩大了防潮袋（MBB）的覆盖范围、烘烤对印制板可焊性的影响、ESD问题、蚀刻芯和复合材料、干燥剂材料和HIC卡的水分问题，以及包装和搬运要求的下降示例。

The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called out within procurement documentation. The IPC-1602 standard provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, moisture concerns for etched cores and composites, desiccant material and HIC cards, and example of flow downs of packaging and handling requirements.