IEC 60749-28:2022作为IEC 60749-28:2022 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC 60749-28:2022建立了测试程序根据器件和微电路因暴露于规定的场致带电器件模型(CDM)静电放电(ESD)而对其损坏或退化的敏感性（灵敏度）进行评估和分类。所有封装的半导体器件、薄膜电路、声表面波（SAW）器件、光电器件、混合集成电路（HIC）和包含任何这些器件的多芯片模块（MCM）都应根据本文件进行评估。为了执行测试，将设备组装成类似于最终应用中预期的封装。本CDM文件不适用于插座式放电模型测试仪。本文档描述了场诱导(FI)方法。附录J中描述了一种替代方法，即直接接触（DC）方法。本文件的目的是建立一种测试方法，该方法将复制CDM故障，并在测试仪之间提供可靠、可重复的CDM ESD测试结果，无论设备类型如何。可重复的数据将允许对CDM ESD敏感性水平进行准确的分类和比较。与上一版相比，此版本包括以下重大技术变更: -一个新的分条款和附件，涉及与非常小封装的集成电路和分立半导体的清洁发展机制测试有关的问题； -澄清器械和测试仪清洁的变更。

IEC 60749-28:2022 is available as IEC 60749-28:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-28:2022 establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex J. The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels. This edition includes the following significant technical changes with respect to the previous edition:
- a new subclause and annex relating to the problems associated with CDM testing of integrated circuits and discrete semiconductors in very small packages;
- changes to clarify cleaning of devices and testers.