IEC 62047-22:2014规定了一种拉伸试验方法，用于测量粘结在非导电柔性基板上的导电薄微机电系统（MEMS）材料的机电性能。柔性衬底上的导电薄膜结构广泛应用于MEMS、消费品和柔性电子产品中。由于界面相互作用，柔性衬底上薄膜的电学行为不同于独立薄膜和衬底。柔性基板和薄膜的不同组合通常会对测试结果产生不同的影响，这取决于测试条件和界面附着力。 薄MEMS材料的期望厚度是柔性基板的50倍，而所有其他尺寸彼此相似。

IEC 62047-22:2014 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other.