IEC 61760-3:20 21提供了一套参考要求、工艺条件和相关测试条件，供编制用于通孔回流焊技术的电子元件规范时使用。 本文件的目的是确保具有用于通孔回流焊的引线的元件和表面安装元件可以经历相同的放置和安装过程。在此，本文件定义了当打算进行通孔回流焊时，需要作为任何部件通用、截面或详细规范的一部分的测试和要求。 此外，该文件为元件用户和制造商提供了一组用于通孔回流焊技术的典型工艺条件的参考。 与上一版相比，此版本包括以下重大技术变更:a)改变位置公差要求（最大0.4 mm至0.2 mm和0.4 mm之间）； b)引入通孔空缺法作为焊膏供应方式。

IEC 61760-3:2021 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended.
Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.
This edition includes the following significant technical changes with respect to the previous edition:
a) change position tolerance requirement (0,4 mm maximum to between 0,2 mm and 0,4 mm);
b) introduce through-hole vacant method as a solder paste supply method.