Device embedding assembly technology-Generic specification for device embedded substrates
设备嵌入组装技术

2019-12-17

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
器件嵌入组装技术第1部分:器件嵌入基板总规范

2019-10-14

부품내장실장기술 —제1부: 부품내장기판의 일반 규격
器件嵌入组装技术.第1部分:器件嵌入基板总规范

2021-07-26

Device embedded substrate-Generic specification. Test methods
器件嵌入基板

2015-07-31

埋入元件印制根性能规范
Performace specification for embedded passive devices printed circuit boards

2018-01-18

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
刚性和多层印制板用嵌入式无源器件电容器材料规范

2006-05-01

Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
刚性和多层印制板用嵌入式无源器件电阻器材料规范

2008-05-01

Device embedded substrate - Part 1-1: Generic specification - Test methods
设备嵌入式基板 - 第1-1部分:通用规范 - 测试方法

2015-05-20

부품내장기판 —제1-1부: 일반 규격 — 시험방법
嵌入式器件基板.第1-1部分:总规范.试验方法

2022-06-28

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019); German version EN IEC 62878-1:2019
器件嵌入组装技术.第1部分:器件嵌入基板的总规范（IEC 62878-1-2019）；德国版本EN IEC 62878-1:2019

2021-10-01

Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
器件嵌入组件技术.第2-10部分:空腔衬底的设计规范

2024-01-31

Device embedded substrate - Part 1-1: Generic specification - Test methods (IEC 62878-1-1:2015); German version EN 62878-1-1:2015
嵌入式器件基板.第1-1部分:总规范.试验方法（IEC 62878-1-1-2015）；德文版EN 62878-1-1:2015

2016-03-01