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现行 IEC 62047-14:2012
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Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials 半导体器件 - 微机电器件 - 第14部分:金属膜材料的成形极限测量方法
发布日期: 2012-02-28
IEC 62047-14:2012描述了测量厚度范围为0.5μm的金属膜材料成形极限的定义和程序;米到300亩;m、 本文所述的金属薄膜材料通常用于电子元件、MEMS和微器件中。当MEMS中使用的金属膜材料(见IEC 62047-1:2005的2.1.2)通过压印等成型工艺制造时,有必要预测材料失效,以提高组件的可靠性。通过这种预测,通过成型工艺制造MEMS组件的效率也可以提高,因为可以缩短产品开发周期,从而降低制造成本。 本标准介绍了压印过程中材料失效的预测方法之一。
IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices. When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.
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归口单位: TC 47/SC 47F
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