IEC 62435-9:2021规定了包括所有类型的硅和半导体器件积木的存储实践，这些积木以封装或板的形式集成到产品中，可作为完全组装单元或部分组件存储。特别注意的是作为组件和组件的内存，尽管这些方法也适用于异构组件。提供了客户与供应商互动的指南和要求，以管理复杂性。 笔记 在IEC 62435（所有部分）中，术语“组件”可与骰子、晶圆、无源器件和封装器件互换使用。

IEC 62435-9:2021 specifies storage practices encompassing silicon and semiconductor device building blocks of all types that are integrated together to into products in the form of either packages or boards that can be stored as fully assembled units or partial assemblies. Special attention is given to memories as components and assemblies although methods also apply to heterogeneous components. Guidelines and requirements for customer-supplier interaction are provided to manage the complexity. NOTE In IEC 62435 (all parts), the term "components" is used interchangeably with dice, wafers, passives and packaged devices.