现行

DIN/TS 2305-3

Adhesive bonding technology - Quality requirements for adhesive bonding processes - Part 3: Requirements for the adhesive bonding personnel
粘接技术.粘接工艺的质量要求.第3部分:粘接人员的要求

2022-03-01

现行

SJ 21564-2020

军工电子装联粘固工艺要求
Process requirements for adhesive bonding of military electronics assembly

2020-06-03

现行

SAE AS7118/1A

Nadcap Requirements for Prepreg/Adhesive Bonding
Nadcap预浸料/粘合剂粘接要求

2008-07-30

现行

MIL MIL-HDBK-349 Notice 1-Validation 1

Manufacture and Inspection of Adhesive Bonded, Aluminum Honeycomb Sandwich Assemblies for Aircraft
飞机用粘合铝蜂窝夹芯组件的制造和检验

2012-05-17

现行

MIL MIL-HDBK-349 Notice 2-Validation 2

MANUFACTURE AND INSPECTION OF ADHESIVE BONDED, ALUMINUM HONEYCOMB SANDWICH ASSEMBLIES FOR AIRCRAFT
飞机用粘合铝蜂窝夹芯组件的制造和检验

2017-08-14

现行

MIL MIL-HDBK-349

MANUFACTURE AND INSPECTION OF ADHESIVE BONDED, ALUMINUM HONEYCOMB SANDWICH ASSEMBLIES FOR AIRCRAFT
飞机用粘合铝蜂窝夹层组件的制造和检验

1994-09-30

现行

BS ISO 17178-2013

Adhesives. Adhesives for bonding parquet to subfloor. Test methods and minimum requirements
粘合剂 用于将拼花地板粘合到底层地板的粘合剂 试验方法和最低要求

2013-05-31

现行

BS EN ISO 17178-2020

Adhesives. Adhesives for bonding parquet to subfloor. Test methods and minimum requirements
粘合剂 用于将拼花地板粘合到底层地板的粘合剂 试验方法和最低要求

2020-04-23

现行

ISO 17178-2013

Adhesives — Adhesives for bonding parquet to subfloor — Test methods and minimum requirements
粘合剂——用于将拼花地板粘合到底层地板的粘合剂——试验方法和最低要求

2013-04-11

现行

UNE-EN 14293-2007

Adhesives - Adhesives for bonding parquet to subfloor - Test methods and minimum requirements
粘合剂.将拼花地板粘合到底层地板的粘合剂.试验方法和最低要求

2007-09-19

现行

DID DI-QCIC-80560

QUALITY CONTROL DATA FROM THE MANUFACTURING PROCESS OF ADHESIVELY BONDED ASSEMBLIES
粘接组件制造过程中的质量控制数据

1988-04-08

现行

GB/T 37315-2019

木结构胶粘剂胶合性能基本要求
Basic requirements of bond performance of adhesives of timber structures

2019-03-25

现行

MIL MIL-HDBK-83377 Notice 1-Validation 1

ADHESIVE BONDING (STRUCTURAL) FOR AEROSPACE AND OTHER SYSTEMS, REQUIREMENTS FOR
航空航天和其他系统用粘接（结构）.要求

2019-12-17

现行

UNE-EN 14294-2010

Adhesives for leather and footwear materials - Preparation of bonded test pieces by moulding-on processes
皮革和鞋类材料用粘合剂.通过模压工艺制备粘结试样

2010-05-05

现行

DIN EN ISO 17178

Adhesives - Adhesives for bonding parquet to subfloor - Test methods and minimum requirements (ISO 17178:2013)
粘合剂.将拼花地板粘合到底层地板的粘合剂.试验方法和最低要求（ISO 17178-2013）

2020-06-01

现行

SJ 21276-2018

微波组件键合工艺技术要求
Process technical requirements for wire bonding of microwave assembly

2018-01-18

现行

ISO 20152-1-2010

Timber structures — Bond performance of adhesives — Part 1: Basic requirements
木结构——胶粘剂的粘接性能第1部分:基本要求

2010-07-20

现行

ISO 20152-2-2011

Timber structures — Bond performance of adhesives — Part 2: Additional requirements
木结构——胶粘剂的粘结性能第2部分:附加要求

2011-07-18

现行

SJ 21448-2018

集成电路陶瓷封装 键合前检验要求
Integrated circuit ceramic package-Inspection requirements for pre-bonding

2018-01-18

现行

DIN ISO 17178-DRAFT

Draft Document - Adhesives - Adhesives for bonding parquet to subfloor - Test methods and minimum requirements (ISO 17178:2013)
文件草案.粘合剂.将拼花地板粘合到底层地板的粘合剂.试验方法和最低要求（ISO 17178-2013）

2014-11-01