1.1本规程涵盖了确定低能（300 keV或以下）单间隙电子束辐射处理设施性能所需遵循的剂量学程序。还讨论了与设施特性、产品鉴定和常规处理相关的其他实践和程序。 1.2本规程涵盖的电子能量范围为80 keV至300 keV。这种电子束可以由单间隙独立热灯丝或等离子体源加速器产生。 1.3 本标准并非旨在解决与其使用相关的所有安全问题（如有）。本标准的用户有责任在使用前制定适当的安全和健康实践，并确定监管限制的适用性。 ====意义和用途====== 4.1各种辐照或处理工艺使用低能电子处理器来修改产品特性。剂量测定要求、测量次数和频率以及记录保存要求将因所加工产品的类型和最终用途而异。剂量学测量通常与产品的物理、化学或生物测试结合使用，以帮助验证特定的治疗参数。 注1-在许多情况下，可以开发参考数据，将剂量学结果与其他定量产品测试进行比较；例如，凝胶分数、熔体流动、模量、分子量分布或固化分析测试可用于估计特定相关材料中的辐射剂量。 4.2辐射处理规范通常包括最小或最大吸收剂量限制，或两者兼有。 对于给定的应用，这些限制可以由政府法规或产品本身固有的限制设定。 4.3必须控制关键工艺参数，以在加工材料中获得可再现的剂量分布。电子束能量（单位:eV或keV）、束流（单位:mA）、束的空间分布以及曝光时间或工艺线速度都会影响吸收剂量。 注2-在一些液固聚合应用中（通常称为辐射固化），必须控制辐照期间的残余氧水平，以获得一致的结果。在这些固化应用中，高水平的残余氧会影响产品性能，但不会影响吸收剂量。然而，应考虑氧对用于剂量测量的剂量计响应函数的影响。 4.4在使用任何辐射处理系统之前，必须对其进行验证，以确定其有效性。这包括测试工艺设备，校准测量仪器，并证明能够以可靠和可复制的方式在所需剂量范围内提供所需剂量。

1.1 This practice covers dosimetric procedures to be followed to determine the performance of low energy (300 keV or less) single-gap electron beam radiation processing facilities. Other practices and procedures related to facility characterization, product qualification, and routine processing are also discussed. 1.2 The electron energy range covered in this practice is from 80 keV to 300 keV. Such electron beams can be generated by single-gap self-contained thermal filament or plasma source accelerators. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. ====== Significance And Use ====== 4.1 A variety of irradiation or treatment processes use low energy electron processors to modify product characteristics. Dosimetry requirements, the number and frequency of measurements, and record keeping requirements will vary depending on the type and end use of the products being processed. Dosimetry measurements are often used in conjunction with physical, chemical, or biological testing of the product, to help verify specific treatment parameters. NOTE 1 - In many cases reference data may be developed, comparing dosimetry results with other quantitative product testing; for example, gel fraction, melt flow, modulus, molecular weight distribution, or cure analysis tests can be used to estimate radiation dose in specific relevant materials. 4.2 Radiation processing specifications usually include a minimum or maximum absorbed dose limit, or both. For a given application these limits may be set by government regulation or by limits inherent to the product itself. 4.3 Critical process parameters must be controlled to obtain reproducible dose distribution in processed materials. The electron beam energy (in eV or keV), beam current (in mA), spatial distribution of the beam, and exposure time or process line speed all affect absorbed dose. NOTE 2 - In some liquid-to-solid polymerization applications (often referred to as radiation curing), the residual oxygen level during irradiation must be controlled to achieve consistent results. A high level of residual oxygen can affect product performance in these curing applications, but does not affect the absorbed dose. However, oxygen effects on the response function of the dosimeter used in the measurement of dose should be taken into account. 4.4 Before any radiation process system can be utilized, it must be validated to determine its effectiveness. This involves testing of the process equipment, calibrating the measuring instruments, and demonstrating the ability to deliver the desired dose within the desired dose range in a reliable and reproducible manner.