IEC 61188-5-3:20 07提供了用于两侧带有鸥翼引线的电子元件表面连接的焊盘图案几何形状的信息。本文提供的信息的意图是提供表面安装焊盘图案的适当尺寸、形状和公差，以确保用于适当的焊料圆角的足够面积，并且还允许那些焊料接头的检查、测试和返工。每个条款都包含一组特定的标准，使得呈现的信息一致，提供关于组件、组件尺寸、焊点设计和焊盘图案尺寸的信息。 本出版物应与IEC 61188-5-1:20 02一起阅读。

IEC 61188-5-3:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions.

This publication is to be read in conjunction with IEC 61188-5-1 :2002.