现行

JIS C 6481-1996

Test methods of copper-clad laminates for printed wiring boards
印制线路板用覆铜层压板的试验方法

1996-01-01

现行

JIS C 6471-1995

Test methods of copper-clad laminates for flexible printed wiring boards
挠性印制线路板用覆铜层压板的试验方法

1995-01-01

现行

GB/T 4721-2021

印制电路用刚性覆铜箔层压板通用规则
General rules for rigid copper clad laminates for printed circuits

2021-11-26

现行

JIS C 6482-1997

Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
印制线路板用覆铜层压板纸基环氧树脂

1997-01-01

现行

JIS C 6472-1995

Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)
挠性印制线路板用覆铜层压板（聚酯膜、聚酰亚胺膜）

1995-01-01

现行

JIS C 6483-1997

Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin
印制线路板用覆铜层压板合成纤维织物基环氧树脂

1997-01-01

现行

SJ 20224-1992

印制线路板用阻燃型覆铜箔环氧玻璃布层压板详细规范
Detail specification for epoxide woven glass fabric copper-clad laminated sheets of flammability resistance for printed wiring boards

1992-11-19

现行

BS EN 60249-2-3-1994

Specifications-Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-04-15

现行

GB/T 12630-1990

一般用途的薄覆铜箔环氧玻璃布层压板 （制造多层印制板用）
Thin epoxide woven glass fabric copper-clad laminated sheet， general purpose grade， for use in the fabrication of multilayer printed boards

1990-12-28

现行

BS EN 60249-2-11-1994

Specifications-Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
规格

2001-06-15

现行

KS C IEC 60249-2-11(2017 Confirm)

인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印制电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃纤维布覆铜层压板

2002-08-31

现行

KS C IEC 60249-2-11(2022 Confirm)

인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印刷电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃织物覆铜层压板

2002-08-31

现行

MIL MIL-P-13949/8D Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GT 玻璃基 编织聚四氟乙烯树脂 阻燃 覆铜（取代MIL-P-13949/8C）（无S/S文件）

1994-07-11

现行

MIL MIL-P-13949/8D Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
塑料片 层压材料 金属层（印刷线路板） 基材GT 玻璃基 WOVEN 聚四氟乙烯树脂 耐火树脂 铜箔（取代MIL-P-13949/8C）（NO S/S文件）

1988-03-28

现行

MIL MIL-P-13949/8D

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
覆铜箔阻燃聚四氟乙烯树脂编织玻璃基GT基材金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/8C）（无S/S文件）

1988-03-28

现行

MIL MIL-P-13949/6D Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GP 玻璃基 无纺布 聚四氟乙烯树脂 阻燃 覆铜（取代MIL-P-13949/6C）（无S/S文件）

1994-07-11

现行

MIL MIL-P-13949/6D Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
塑料片 层压材料 金属层（印刷线路板） 基材GP 玻璃基 非织造布 聚四氟乙烯树脂 耐火树脂 铜箔（取代MIL-P-13949/6C）（无S/S文件）

1987-02-11

现行

MIL MIL-P-13949/6D Notice 2-Inactivation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GP 玻璃基 无纺布 聚四氟乙烯树脂 阻燃 覆铜（取代MIL-P-13949/6C）（无S/S文件）

1997-08-01

现行

MIL MIL-P-13949/6D

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
覆铜阻燃聚四氟乙烯树脂无纺布基材GP玻璃基金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/6C）（无S/S文件）

1987-02-11

现行

MIL MIL-P-13949/3B Notice 1-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GE, GLASS BASE, WOVEN, MAJORITY DIFUNCTIONAL EPOXY RESIN, GENERAL PURPOSE, COPPER-CLAD (SUPERSEDING MIL-P-13949/3A) (S/S BY MIL-P-13949/4C)
层压塑料片 金属覆层（用于印刷线路板） 基材GE 玻璃基 编织 大多数双功能环氧树脂 通用 覆铜（取代MIL-P-13949/3A）（S/S BY MIL-P-1394.9/4C）

1988-06-14