现行

EIA/JESD 22-B104A

Test Methods and Procedures for Solid State Devices - Mechanical Shock
固态器件的试验方法和程序.机械冲击

2001-03-01

现行

GB/T 42896-2023

微机电系统（MEMS）技术 硅基MEMS纳尺度结构冲击试验方法
Micro-electromechanical systems（MEMS） technology—Impact test method for nanostructures of silicon based MEMS

2023-08-06

现行

GB/T 38341-2019

微机电系统(MEMS)技术　MEMS器件的可靠性综合环境试验方法
Micro-electromechanical system technology—The reliability test methods of MEMS in integrated environments

2019-12-31

现行

GB/T 42191-2023

MEMS压阻式压力敏感器件性能试验方法
Test methods of the performances for MEMS piezoresistive pressure-sensitive device

2023-05-23

现行

IEC 60749-10-2022

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
半导体器件.机械和气候试验方法.第10部分:机械冲击.器件和组件

2022-04-27

现行

EN IEC 60749-10-2022

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
半导体器件.机械和气候试验方法.第10部分:机械冲击.器件和组件

2022-06-10

现行

KS C IEC 60749-10

반도체 소자 — 기계 및 기후적 환경 시험방법 — 제10부: 기계적 충격
半导体器件 - 机械和气候试验方法 - 第10部分:机械冲击

2020-07-23

现行

UNE-EN 60749-10-2003

Semiconductor devices - Mechanical and climatic test methods -- Part 10: Mechanical shock.
半导体器件.机械和气候试验方法.第10部分:机械冲击

2003-05-30

现行

GB/T 41852-2022

半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法
Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

2022-10-12

现行

GB/T 6552-2015

玻璃容器 抗机械冲击试验方法
Glass containers—Test method for impact resistance

2015-09-11

现行

IEC 62047-21-2014

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
半导体器件微机电器件第21部分:薄膜MEMS材料泊松比的试验方法

2014-06-19

现行

IEC 62047-44-2024

Semiconductor devices - Micro-electromechanical devices - Part 44: Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices
半导体器件.微机电器件.第44部分:MEMS谐振电场敏感器件动态性能的试验方法

2024-02-22

现行

JB/T 12837-2016

机械冲击式超微粉碎设备试验方法
Test method for ultra-micro grinding equipment of mechanical impact type

2016-04-05

现行

IEC 62047-34-2019

Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
半导体器件微机电器件第34部分:硅片上MEMS压阻压敏器件的试验方法

2019-04-05

现行

KS T 1332(2022 Confirm)

포장 설계를 위한 제품의 충격강도 시험방법
包装设计产品机械冲击脆性试验方法

2012-12-06

现行

ASTM D3332-99(2023)

Standard Test Methods for Mechanical-Shock Fragility of Products, Using Shock Machines
用冲击机测定产品机械冲击脆性的标准试验方法

2023-10-01

现行

BS EN 60749-20-1-2009

Semiconductor devices. Mechanical and climatic test methods-Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
半导体器件 机械和气候试验方法

2009-07-31

现行

BS EN 60749-5-2017

Semiconductor devices. Mechanical and climatic test methods-Steady-state temperature humidity bias life test
半导体器件 机械和气候试验方法

2017-07-20

现行

BS EN IEC 60749-15-2020

Semiconductor devices. Mechanical and climatic test methods-Resistance to soldering temperature for through-hole mounted devices
半导体器件 机械和气候试验方法

2020-10-01

现行

BS EN 60749-38-2008

Semiconductor devices. Mechanical and climatic test methods-Soft error test method for semiconductor devices with memory
半导体器件 机械和气候试验方法

2008-06-30