现行

SJ/Z 1089-1976

镀金溶液典型分析方法
Typical methods for the analysis of gold-plating solution

1976-09-02

现行

SJ/Z 1087-1976

镀锡溶液典型分析方法
Typical methods for the analysis of tin-plating solution

1976-09-02

现行

SJ/Z 1091-1976

镀钯溶液典型分析方法
Typical methods for the analysis of palladium plating solution

1976-09-02

现行

SJ/Z 1090-1976

镀铂溶液典型分析方法
Typical methods for the analysis of platinum plating solution

1976-09-02

现行

SJ/Z 1086-1976

镀镉溶液典型分析方法
Typical methods for the analysis of cadmium-plating solution

1976-09-02

现行

SJ/Z 1085-1976

镀锌溶液典型分析方法
Typical methods for the analysis of zine-plating solution

1976-09-02

现行

SJ/Z 1084-1976

镀铜溶液典型分析方法
Typical methods for the analysis of copper-plating solution

1976-09-02

现行

SJ/Z 1083-1976

镀铬溶液典型分析方法
Typical methods for the analysis of chromium-plating solution

1976-09-02

现行

SJ/Z 1082-1976

镀镍溶液典型分析方法
Typical methods for the analysis of nickel-plating solution

1976-09-02

现行

SJ/Z 1088-1976

氧化镀银溶液典型分析方法
Typical methods for the analysis of cyaniding silver-plating solution

1976-09-02

现行

SJ/Z 1095-1976

镀铅锡合金溶液典型分析方法
Typical methods for the analysis of lead-tin alloy plating solution

1976-09-02

现行

SJ/Z 1094-1976

氰化镀铜锡合金溶液典型分析方法
Typical methods for the analysis of cyaniding coper-tin alloy plating solution

1976-09-02

现行

SJ/Z 1097-1976

其他溶液典型分析方法
Typical methods for the analysis of other solutions

1976-09-02

现行

SJ/Z 1093-1976

氰化镀铜锌合金（黄铜）溶液典型分析方法
Typical methods for the analysis of cyaniding copper-zinc alloy(yellow porgy) plating solution

1976-09-02

现行

SJ/Z 1081-1976

电镀溶液典型分析方法的一般要求
General requirements for typical methods for the analysis of electroplating solution

1976-09-02

现行

HB/Z 5087.6-2004

酸性电镀铜溶液分析方法 第6部分:分光光度法测定砷的含量
Methods for analysis of acid plating copper solutions part 6:Determination of arsenic content by spectrophotometric method

2004-02-16

现行

HB 20056.1-2011

锡-铋合金镀层及电镀锡-铋合金溶液分析方法 第1部分：分光光度法测定铋含量
Methods for analysis of Sn-Bi alloy plating and plating Sn-Bi alloy solutions-Part 1:Determination of bismuth content by spectrophotometric method

2011-07-19

现行

HB/Z 5096.1-2004

电镀铅溶液分析方法 第1部分:EDTA容量法测定氧化铅的含量
Methods for analysis of plating lead solutions-part 1:Determination of lead oxide content by EDTA volumetric method

2004-02-16

现行

HB 20056.5-2011

锡-铋合金镀层及电镀锡-铋合金溶液分析方法 第5部分：沉淀滴定法测定氯化钠含量
Methods for analysis of Sn-Bi alloy plating and plating Sn-Bi alloy solutions-Part 5:Determination of sodium chloride content by depositiontitrimetric method

2011-07-19

现行

HB 20056.2-2011

锡-铋合金镀层及电镀锡-铋合金溶液分析方法 第2部分：分光光度法测定硝酸铋含量
Methods for analysis of Sn-Bi alloy plating and plating Sn-Bi alloy solutions-Part 2:Determination of bismuth nitrate content by spectrophotometric method

2011-07-19