新的！IEC 61709:2017作为IEC 61709:2017 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC 61709:2017为使用故障率数据进行可靠性预测提供了指导。本文档中介绍的方法使用参考条件的概念，参考条件是大多数应用中部件观察到的典型应力值。参考条件是有用的，因为它们提供了已知的标准基础，故障率可以根据该基础进行修改，以考虑环境与作为参考条件的环境的差异。每个用户可以使用本文档中定义的参考条件或使用自己的参考条件。当使用参考条件下规定的故障率时，可以在早期设计阶段进行现实的可靠性预测。本文描述的应力模型是通用的，并且可以在需要时用作将在这些参考条件下给出的故障率数据转换为实际操作条件的基础，并且这简化了预测方法。故障率数据的转换只能在组件的指定功能限制内进行。本文档还就如何构建部件失效数据数据库提供了指导，以提供可与所包含的应力模型一起使用的故障率。规定了故障率数据的参考条件，以便可以在统一的基础上比较不同来源的数据。如果根据本文件给出了故障率数据，则可以省略关于指定条件的附加信息。本文档不提供组件的基本故障率，而是提供允许将通过其他方式获得的故障率从一种操作条件转换为另一种操作条件的模型。本文档中描述的预测方法假设零件在其使用寿命内使用。本文件中的方法具有一般应用，但具体应用于如条款6至20和I.2中定义的组分类型的选择。第三版取消并取代了2011年出版的第二版。本版构成技术修订版。第三版是IEC 61709:2011和IEC TR 62380:2004的合并。 与上一版相比，该版本包括以下重大技术变化:增加了4。5元件选择，4.6新设备部署阶段的可靠性增长，4.7如何使用本文件，以及关于IEC TR 62380的第19条印刷电路板（PCB）和第20条混合电路；增加附件A中部件的失效模式；附录B《半导体热模型》的修改，采用并修订自IEC TR 62380；修正附件D，关于任务概况的考虑；附件E使用寿命模型的修改，采用并修订自IEC TR 62380；修订附件F（原B.2.6.4），失效物理学；增加附件G（原附件C），设计故障率数据库的考虑因素，补充IEC 60319的部分内容；增加附件H，故障率数据的潜在来源和选择方法；根据IEC 60319增加附录J组件可靠性数据的表述。 关键词:故障率数据电气元件可靠性预测

NEW!IEC 61709:2017 is available as IEC 61709:2017 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 61709:2017 gives guidance on the use of failure rate data for reliability prediction of electric components used in equipment. The method presented in this document uses the concept of reference conditions which are the typical values of stresses that are observed by components in the majority of applications.  Reference conditions are useful since they provide a known standard basis from which failure rates can be modified to account for differences in environment from the environments taken as reference conditions. Each user can use the reference conditions defined in this document or use their own. When failure rates stated at reference conditions are used it allows realistic reliability predictions to be made in the early design phase. The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach. Conversion of failure rate data is only possible within the specified functional limits of the components. This document also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with. This document does not provide base failure rates for components – rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition. The prediction methodology described in this document assumes that the parts are being used within its useful life. The methods in this document have a general application but are specifically applied to a selection of component types as defined in Clauses 6 to 20 and I.2. This third edition cancels and replaces the second edition, published in 2011. This edition constitutes a technical revision. This third edition is a merger of IEC 61709:2011 and IEC TR 62380:2004.
This edition includes the following significant technical changes with respect to the previous edition: addition of 4.5 Components choice, 4.6 Reliability growth during the deployment phase of new equipment, 4.7 How to use this document, and of Clause 19 Printed circuit boards (PCB) and Clause 20 Hybrid circuits with respect to IEC TR 62380; addition of failure modes of components in Annex A; modification of Annex B, Thermal model for semiconductors, adopted and revised from IEC TR 62380; modification of Annex D, Considerations on mission profile; modification of Annex E, Useful life models, adopted and revised from IEC TR 62380; revision of Annex F (former B.2.6.4), Physics of failure; addition of Annex G (former Annex C), Considerations for the design of a data base on failure rates, complemented with parts of IEC 60319;  addition of Annex H, Potential sources of failure rate data and methods of selection; addition of Annex J, Presentation of component reliability data, based on IEC 60319.

Keywords: failure rate data, reliability prediction of electric components