现行

DOD DOD-C-55681/11

CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR35 METRIC
已确立可靠性的陶瓷介质多层固定无封装片式电容器CDR35公制

1983-08-25

现行

SJ 20318-1993

ＣＣＫ４１０３型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CCK4103

1993-05-11

现行

SJ 20314-1993

ＣＴＫ４１０４型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4104

1993-05-11

现行

SJ 20313-1993

ＣＴＫ４１０３型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4103

1993-05-11

现行

SJ 20312-1993

ＣＴＫ４１０２型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4102

1993-05-11

现行

SJ 20311-1993

ＣＣＫ４１０４型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CCK4104

1993-05-11

现行

SJ 20203-1992

ＣＴＫ４１０１型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability, Type CTK4101

1992-11-19

现行

DOD DOD-C-55681/8

CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR32 METRIC(NO S/S DOCUMENT)
固定式、非封装、陶瓷介质多层片式电容器 已确立的可靠性类型CDR32公制（无S/S文件）

1983-08-25

现行

DOD DOD-C-55681/9

CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR33 METRIC(NO S/S DOCUMENT)
固定式、非封装、陶瓷介质多层片式电容器 已确立的可靠性类型CDR33公制（无S/S文件）

1983-08-25

现行

MIL MIL-PRF-49464/1C Notice 1-Validation 1

Capacitors, Chip, Single Layer, Fixed Unencapsulated, Ceramic Dielectric, Established Reliability, Style CPCR01 (High Frequency)
CPCR01型（高频）陶瓷电介质固定式单层芯片电容器

2016-03-22

现行

MIL MIL-C-55681D Supplement 1

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-C-55681C) (S/S BY MIL-PRF-55681E)
已确定可靠性的多层固定、未封装陶瓷电介质芯片电容器（取代MIL-C-55681C）的通用规范

1994-07-13

现行

MIL MIL-C-55681D

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-C-55681C) (S/S BY MIL-PRF-55681E)
已确立可靠性的多层固定无封装陶瓷介质片式电容器（取代MIL-C-55681C）（由MIL-PRF-55681E提供）

1994-07-13

现行

MIL MIL-PRF-55681G Supplement 1

Capacitor, Chip, Multiple Layer, Fixed Ceramic Dielectric, Established Reliability and Non-Established Reliability, General Specification for
确定可靠性和非确定可靠性的多层固定陶瓷电介质芯片电容器通用规范

2016-07-12

现行

MIL MIL-PRF-55681/3E Notice 1-Validation

Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Style CDR06
电容器芯片多层固定陶瓷介质既定可靠性与非既定可靠性CDR06

2011-10-20

现行

MIL MIL-PRF-55681/2D Notice 1-Validation

Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Style CDR05
CDR05型已确定可靠性和未确定可靠性的多层固定陶瓷电介质芯片电容器

2011-10-20

现行

MIL MIL-PRF-55681/2D Notice 2-Validation

Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Style CDR05
CDR05型已确定可靠性和未确定可靠性的多层固定陶瓷电介质芯片电容器

2016-07-26

现行

MIL MIL-PRF-55681/3E Notice 2-Validation

Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Style CDR06
CDR06型既定可靠性和非既定可靠性多层固定陶瓷电介质芯片电容器

2016-07-26

现行

MIL MIL-PRF-55681/2D-Notice 2-Validation

Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Style CDR05
CDR05型已确定可靠性和未确定可靠性的多层固定陶瓷电介质芯片电容器

2016-07-26

现行

MIL MIL-PRF-55681G

Capacitor, Chip, Multiple Layer, Fixed Ceramic Dielectric, Established Reliability and Non-Established Reliability, General Specification for
片式多层固定陶瓷电介质电容器 既有可靠性和非既有可靠性 通用规范

2016-07-12

现行

MIL MIL-PRF-55681/13

Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Style CDR37
电容器 芯片 多层 固定 陶瓷介质 既有可靠性和非既有可靠性 CDR37型

2016-07-12