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现行 IEC 62899-202-10:2023
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Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer 印刷电子器件.第202-10部分:材料.热成型导电层的电阻测量方法
发布日期: 2023-08-16
IEC 62899-202-10:20 23定义了作为热塑性伸长率函数的导电油墨层的电阻变化的术语和测量方法。该方法测量原位或拉伸后的电阻变化。 本文件适用于具有导电油墨层的可热成型基材。可热成型基材也可以具有印刷的图形油墨并覆盖绝缘层。
IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation. The method measures resistance changes in-situ or post-elongation.
This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.
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归口单位: TC 119
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