1.1这些试验方法用于通过测量晶粒截距长度、截距计数、相交计数、晶界长度和晶粒面积来确定晶粒尺寸。 1.2使用半自动数字化仪或使用显微镜产生的晶粒结构图像进行自动图像分析进行测量。 1.3这些试验方法适用于任何类型的晶粒结构或晶粒尺寸分布，只要可以通过蚀刻和后续图像处理（如有必要）清楚地描绘出晶界。 1.4这些试验方法适用于测量其他类似晶粒的微观结构，如电池结构。 1.5本标准仅涉及推荐的试验方法，其中的任何内容均不应解释为定义或确定试验材料的可接受性或适用性限制。 1.6 本标准并非旨在解决与其使用相关的所有安全问题（如有）。本标准的用户有责任在使用前制定适当的安全和健康实践，并确定监管限制的适用性。 1.7各节按以下顺序出现: ====意义和用途====== 这些试验方法涵盖了确定具有等轴或变形晶粒形状、均匀或双重晶粒尺寸分布的多晶金属和非金属材料以及单相或多相晶粒结构的平均晶粒尺寸和晶粒截距长度或晶粒面积分布的程序。 使用半自动数字化平板电脑图像分析仪或自动图像分析仪进行测量。 这些设备大大减轻了与手动测量相关的繁琐工作，因此可以收集更多的数据和更广泛的采样，这将产生比手动方法更好的粒度统计定义。 测试结果的精度和相对准确性取决于试样的代表性、试样制备的质量、晶界的清晰度（使用的蚀刻技术和蚀刻剂）、测量的晶粒数或测量区域、检测晶界或晶粒内部的误差，由于检测其他特征（碳化物、夹杂物、孪晶界等）、测量场的代表性和编程错误而导致的错误。 这些试验方法的结果可用于根据买方和制造商之间商定的指南对装运材料进行鉴定，比较不同的制造工艺或工艺变化，或提供结构数据- 财产行为研究。

1.1 These test methods are used to determine grain size from measurements of grain intercept lengths, intercept counts, intersection counts, grain boundary length, and grain areas. 1.2 These measurements are made with a semiautomatic digitizing tablet or by automatic image analysis using an image of the grain structure produced by a microscope. 1.3 These test methods are applicable to any type of grain structure or grain size distribution as long as the grain boundaries can be clearly delineated by etching and subsequent image processing, if necessary. 1.4 These test methods are applicable to measurement of other grain-like microstructures, such as cell structures. 1.5 This standard deals only with the recommended test methods and nothing in it should be construed as defining or establishing limits of acceptability or fitness for purpose of the materials tested. 1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. 1.7 The sections appear in the following order: ====== Significance And Use ====== These test methods cover procedures for determining the mean grain size, and the distribution of grain intercept lengths or grain areas, for polycrystalline metals and nonmetallic materials with equiaxed or deformed grain shapes, with uniform or duplex grain size distributions, and for single phase or multiphase grain structures. The measurements are performed using semiautomatic digitizing tablet image analyzers or automatic image analyzers. These devices relieve much of the tedium associated with manual measurements, thus permitting collection of a larger amount of data and more extensive sampling which will produce better statistical definition of the grain size than by manual methods. The precision and relative accuracy of the test results depend on the representativeness of the specimen or specimens, quality of specimen preparation, clarity of the grain boundaries (etch technique and etchant used), the number of grains measured or the measurement area, errors in detecting grain boundaries or grain interiors, errors due to detecting other features (carbides, inclusions, twin boundaries, and so forth), the representativeness of the fields measured, and programming errors. Results from these test methods may be used to qualify material for shipment in accordance with guidelines agreed upon between purchaser and manufacturer, to compare different manufacturing processes or process variations, or to provide data for structure-property-behavior studies.