现行

KS C 6249-5-1(2020 Confirm)

프린트 배선판용 동박
印刷线路板铜箔

2000-04-15

现行

JIS C 6515-1998

Copper foil for printed wiring boards
印制线路板用铜箔

1998-01-01

现行

GB/T 31980-2015

电解铜箔用再生铜线
Recycling copper wire for electrodeposited copper foil

2015-09-11

现行

IPC 4563

Resin Coated Copper Foil for Printed Boards Guideline
印制板用树脂涂覆铜箔指南

2007-11-01

现行

YS/T 1039-2015

挠性印制线路板用压延铜箔
Rolled copper foil for flexible printed circuit board

2015-04-30

现行

GB/T 29847-2013

印制板用铜箔试验方法
Test methods for copper foil used for printed boards

2013-11-12

现行

SJ/T 11483-2014

锂离子电池用电解铜箔
Electrodeposited copper foil for lithium ion battery

2014-10-14

现行

SJ 21287-2018

高密度互连印制电路用涂树脂铜箔规范
Specification for resin coated copper foil of HDI printed circuit board

2018-01-18

现行

UNE 20620-4-1980

METAL-CLAD BASE MATERIALS FOR PRINTED CIRCUITS. COPPER FOIL
印制电路用金属包覆基材 铜箔

1980-12-15

现行

BS 4584-103.2-1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for copper foil for use in the manufacture of copper-clad base materials
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 覆铜基材制造用铜箔规范

1990-02-28

现行

SJ/Z 21089-2016

印制板镀铜指南
Guide for copper plating of printed circuit boards

2016-01-19

现行

SJ 21292-2018

印制板用磷铜阳极规范
Specification of phosphor copper anode for printed circuit boards

2018-01-18

现行

SJ 21084-2016

印制电路用刚性覆铜箔层压板规范
Specification for rigid copper-clad laminatedsheets for printed circuit boards

2016-01-19

现行

JIS C 6481-1996

Test methods of copper-clad laminates for printed wiring boards
印制线路板用覆铜层压板的试验方法

1996-01-01

现行

JIS C 6480-1994

General rules of copper-clad laminates for printed wiring boards
印制线路板用覆铜层压板通则

1994-01-01

现行

JIS C 6471-1995

Test methods of copper-clad laminates for flexible printed wiring boards
挠性印制线路板用覆铜层压板的试验方法

1995-01-01

现行

GB/T 4722-2017

印制电路用刚性覆铜箔层压板试验方法
Test methods for rigid copper clad laminates for printed circuits board

2017-05-31

现行

GOST 26246.14-1991

Материалы электроизоляционные фольгированные для печатных плат. Склеивающая прокладка, используемая при изготовлении многослойных печатных плат. Технические условия
用于制造印刷板的覆箔电绝缘材料 预浸料用作制造多层印刷板的粘合片材料 规格

现行

JIS C 6482-1997

Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
印制线路板用覆铜层压板纸基环氧树脂

1997-01-01

现行

JIS C 6472-1995

Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)
挠性印制线路板用覆铜层压板（聚酯膜、聚酰亚胺膜）

1995-01-01