IEC 60749-23:20 04+A1:2011用于确定偏置条件和温度随时间对固态器件的影响。它以加速的方式模拟设备运行条件，主要用于设备鉴定和可靠性监测。使用短持续时间的高温偏置寿命形式，通常称为“老化”，可用于筛查婴儿死亡率相关的故障。老化的详细使用和应用超出了本标准的范围。 本合并版本由第一版（2004年）组成 及其修正案1（2011年）。因此，无须在 本出版物的补充。

IEC 60749-23:2004+A1:2011 is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this standard. This consolidated version consists of the first edition (2004) and its amendment 1 (2011). Therefore, no need to order amendment in addition to this publication.