半导体集成电路门阵列设计总则
Gate array design generals for semiconductor integrated circuits

1994-10-11

Space systems — Semiconductor integrated circuits for space applications — Design requirements
空间系统 - 空间应用的半导体集成电路 - 设计要求

2016-11-17

Space systems. Semiconductor integrated circuits for space applications. Design requirements
太空系统 空间应用半导体集成电路 设计要求

2016-11-30

반도체 소자 - 집적회로 제20-1부 : 필름 집적회로 및 하이브리드 필름 집적회로의 일반 규격서 - 내부 육안검사 요구사항
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范 - 第1部分:内部目视检查的要求

2003-12-31

Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范 - 第1部分:内部目视检查的要求

1994-03-01

半导体器件 集成电路 第20部分：膜集成电路和混合膜集成电路总规范 第一篇：内部目检要求
Semiconductor devices—Integrated circuits—Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits—Section 1: Requirements for internal visual examination

2023-09-07

Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications-General requirements for high reliability integrated circuits and discrete semiconductors
航空电子设备的过程管理 航空航天、国防和高性能（ADHP）应用电子元件

2020-04-29

航空电子过程管理　航空航天、国防及其他高性能应用领域(ADHP)电子元器件　第1部分：高可靠集成电路与分立半导体器件通用要求
Process management for avionics—Electronic components for aerospace,defence and high performance(ADHP)applications—Part 1:General requirements for high reliability integrated circuits and discrete semiconductors

2019-03-25

Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
航空电子设备的过程管理.航空航天、国防和高性能（ADHP）应用的电子元件.第1部分:高可靠性集成电路和分立半导体的一般要求

2020-04-20

Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
航空电子设备的过程管理.航空航天、国防和高性能（ADHP）应用的电子元件.第1部分:高可靠性集成电路和分立半导体的一般要求

2020-04-20

Connectors for frequencies below 3 MHz for use with printed boards-Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
用于印制板的频率低于3MHz的连接器 集成电路用一系列插座的尺寸、一般要求和试验详细规范

1998-05-15

频率低于3 MHz的印制板连接器　第12部分：集成电路插座的尺寸、一般要求和试验方法详细规范
Connectors for frequencies below 3 MHz for use with printed boards—Part 12:Detail specification for dimensions,general requirements and tests for a range of sockets designed for use with integrated circuits

2011-12-30

Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
用于频率低于3 Mhz的连接器用于印刷电路板 - 第12部分:尺寸详细规格 适用于集成电路的一系列插座的一般要求和测试

1992-06-25

인쇄 기판에 사용하는 3 MHz 미만 주파수용 커넥터 — 제12부: 집적 회로에 사용하도록 설계된 소켓의 치수, 일반 요구사항의 시험에 대한 개별 규격
用于频率低于3 Mhz的连接器用于印刷电路板 - 第12部分:尺寸详细规格 适用于集成电路的一系列插座的一般要求和测试

2014-12-09

인쇄 기판에 사용하는 3 MHz 미만 주파수용 커넥터 — 제12부: 집적 회로에 사용하도록 설계된 소켓의 치수, 일반 요구사항의 시험에 대한 개별 규격
印制板用频率低于3MHz的连接器第12部分:集成电路用插座尺寸、一般要求和试验的详细规范

2014-12-09