IEC 62969-4:2018-半导体器件.汽车用半导体接口.第4部分:汽车传感器数据接口的评定方法-国家数字标准馆

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Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors 半导体器件.汽车用半导体接口.第4部分:汽车传感器数据接口的评定方法

发布日期： 2018-06-18

                IEC？62969-4:2018规定了汽车半导体传感器接口的直接故障注入测试方法，该方法可用于支持车辆通信接口的一致性保证。

IEC？62969-4:2018 specifies a method of directly fault injection test for automotive semiconductor sensor interface that can be used to support the conformance assurance in the vehicle communications interface.

分类信息

发布单位或类别：国际组织-国际电工委员会

ICS分类： 31.080.99半导体分立器件 - 其他半导体分立器件

关联关系

研制信息

归口单位： TC 47

相似标准/计划/法规

BS EN IEC 62969-1-2018

Semiconductor devices. Semiconductor interface for automotive vehicles-General requirements of power interface for automotive vehicle sensors
半导体器件汽车用半导体接口

BS EN IEC 62969-4-2018

Semiconductor devices. Semiconductor interface for automotive vehicles-Evaluation method of data interface for automotive vehicle sensors
半导体器件汽车用半导体接口

IEC 62969-1-2017

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
半导体器件汽车半导体接口第1部分:汽车传感器电源接口的一般要求

BS EN IEC 62969-3-2018

Semiconductor devices. Semiconductor interface for automotive vehicles-Shock driven piezoelectric energy harvesting for automotive vehicle sensors
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IEC 62969-3-2018

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
半导体器件汽车半导体接口第3部分:汽车传感器的冲击驱动压电能量收集

BS EN IEC 62969-2-2018

Semiconductor devices. Semiconductor interface for automotive vehicles-Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
半导体器件汽车用半导体接口

IEC 62969-2-2018

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
半导体器件汽车半导体接口第2部分:汽车传感器共振无线电力传输效率评估方法

DIN EN IEC 62969-4

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors (IEC 62969-4:2018); German version EN IEC 62969-4:2018
半导体器件.汽车用半导体接口.第4部分:汽车传感器数据接口的评估方法（IEC 62969-4-2018）；德国版本EN IEC 62969-4:2018

DIN EN IEC 62969-1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors (IEC 62969-1:2017); German version EN IEC 62969-1:2018
半导体器件.汽车用半导体接口.第1部分:汽车传感器电源接口的一般要求（IEC 62969-1-2017）；德国版本EN IEC 62969-1:2018

IEC TR 63357-2022

Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles
半导体器件.汽车故障试验方法的标准化路线图

BS EN 62779-2-2016

Semiconductor devices. Semiconductor interface for human body communication-Characterization of interfacing performances
半导体器件用于人体通讯的半导体接口

DIN EN IEC 62969-3

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors (IEC 62969-3:2018); German version EN IEC 62969-3:2018
半导体器件.汽车用半导体接口.第3部分:汽车传感器的冲击驱动压电能量收集（IEC 62969-3-2018）；德国版本EN IEC 62969-3:2018

BS IEC 62779-4-2020

Semiconductor devices. Semiconductor interface for human body communication-Capsule endoscope
半导体器件用于人体通讯的半导体接口

BS EN 62779-1-2016

Semiconductor devices. Semiconductor interface for human body communication-General requirements
半导体器件用于人体通讯的半导体接口

IEC 62779-2-2016

Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
半导体器件 - 用于人体通信的半导体接口 - 第2部分:接口性能的表征

DIN EN IEC 62969-2

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors (IEC 62969-2:2018); German version EN IEC 62969-2:2018
半导体器件.汽车用半导体接口.第2部分:汽车传感器用谐振无线功率传输的效率评估方法（IEC 62969-2-2018）；德国版本EN IEC 62969-2:2018

IEC 62779-1-2016

Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
半导体器件 - 人体通信半导体界面 - 第1部分:一般要求

IEC 62779-4-2020

Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
半导体器件.人体通信用半导体接口.第4部分:胶囊内窥镜

BS EN 62779-3-2016

Semiconductor devices. Semiconductor interface for human body communication-Functional type and its operational conditions
半导体器件用于人体通讯的半导体接口

IEC 62779-3-2016

Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
半导体器件人体通信用半导体接口第3部分:功能类型及其操作条件

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