Environmental testing-Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
环境测试

2011-11-30

Испытания на воздействие внешних факторов. Часть 2-83. Испытания. Испытание Tf: Испытание на паяемость электронных компонентов для поверхностного монтажа с использованием припойной пасты методом баланса смачивания
环境试验 第2-83部分 测试 测试Tf 通过使用焊膏的润湿平衡法对表面安装装置的电子部件进行可焊性试验

환경시험 — 제2-83부: 시험 — 시험 Tf: 솔더 페이스트를 사용한 젖음 균형법에 의한 표면실장(SMD)용 전자부품의 땜질성 시험
环境试验第2-83部分:试验试验Tf:用焊膏润湿平衡法对表面安装器件（SMD）用电子元件的可焊性试验

2023-12-07

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
环境测试 - 第2-83部分:测试 - 测试Tf:用于表面贴装设备的电子元件（Smd）的可焊性测试通过使用焊膏的润湿平衡法

2011-09-07

BS EN 60068-2-83. Environmental testing. Part 2-83. Tests. Test Tf. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste
英国标准EN 60068-2-83 环境测试 第2-83部分 测验 测试Tf 用无铅焊膏润湿平衡法测试表面贴装器件（SMD）用电子元件的可焊性

2007-04-25

Draft Document - Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste (IEC 91/682/CD:2007)
文件草稿.环境试验.第2-83部分:试验.试验Tf:用无铅焊膏润湿平衡法对表面安装器件（SMD）用电子元件的可焊性试验（IEC 91/682/CD:2007）

2007-09-01