本文从理论上分析了刀具-芯片界面上的芯片形成过程。利用滑移线场理论建立了二次塑性变形区的数学模型。基于SLIPLINE场分析方法，分析了切屑在刀具-切屑界面上的流速分布，并建立了预测其分布的理论模型。基于滑移线场分析，建立了刀具-芯片界面正应力和剪应力分布的预测模型。

IN THIS PAPER, THEORETICAL ANALYSES ARE GIVEN ON CHIP FORMATION ALONG THE TOOL-CHIP INTERFACE. A MATHEMATICAL MODEL FOR THE SECONDARY PLASTIC DEFORMATION ZONE IS DEVELOPED USING THE SLIPLINE FIELD THEORY. CHIP MATERIAL FLOW VELOCITY DISTRIBUTION ALONG THE TOOL-CHIP INTERFACE IS ANALYSED BASED ON THE SLIPLINE FIELD ANALYSIS, AND A THEORETICAL MODEL IS DEVELOPED FOR PREDICTING THE DISTRIBUTION. ALSO BASED ON THE SLIPLINE FIELD ANALYSIS, A PREDICTIVE MODEL FOR THE NORMAL AND SHEAR STRESS DISTRIBUTIONS ALONG THE TOOL-CHIP INTERFACE IS DEVELOPED.