IEC 60749-42:2014提供了一种测试方法，用于评估在高温高湿环境中使用的半导体器件的耐久性。本试验方法用于评估塑料模制和其他类型封装中半导体器件芯片金属互连的耐腐蚀性。它还可用作加速因水分渗透钝化膜而产生的泄漏现象的手段，并用作各种试验的预处理。

IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.