首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 SJ 20312-1993
到馆阅读
收藏跟踪
购买正版
CTK4102型有可靠性指标的非密封多层片状瓷介固定电容器详细规范 Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4102
发布日期: 1993-05-11
实施日期: 1993-07-01
分类信息
关联关系
研制信息
相似标准/计划/法规
现行
SJ 20318-1993
CCK4103型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CCK4103
1993-05-11
现行
SJ 20314-1993
CTK4104型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4104
1993-05-11
现行
SJ 20313-1993
CTK4103型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4103
1993-05-11
现行
SJ 20311-1993
CCK4104型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CCK4104
1993-05-11
现行
SJ 20203-1992
CTK4101型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability, Type CTK4101
1992-11-19
现行
MIL MIL-PRF-55681G Supplement 1
Capacitor, Chip, Multiple Layer, Fixed Ceramic Dielectric, Established Reliability and Non-Established Reliability, General Specification for
确定可靠性和非确定可靠性的多层固定陶瓷电介质芯片电容器通用规范
2016-07-12
现行
MIL MIL-PRF-55681G
Capacitor, Chip, Multiple Layer, Fixed Ceramic Dielectric, Established Reliability and Non-Established Reliability, General Specification for
片式多层固定陶瓷电介质电容器 既有可靠性和非既有可靠性 通用规范
2016-07-12
现行
QPL QPL-55681-121
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR(SUPERSEDING QPL-55681-120)
陶瓷介质多层固定片式电容器 既有可靠性和非既有可靠性 通用规范(代替QPL-55681-120)
2006-03-30
现行
QPL QPL-55681-121
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR(SUPERSEDING QPL-55681-120)
陶瓷介质多层固定片式电容器 既有可靠性和非既有可靠性 通用规范(代替QPL-55681-120)
2006-03-30
现行
MIL MIL-PRF-55681F Supplement 1
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-PRF-55681E)
电容器 芯片 多层 固定 陶瓷电介质 建立的可靠性和非建立的可靠性 一般规格(取代MIL-PRF-55681E)
2004-09-03
现行
MIL MIL-C-55681D Supplement 1
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-C-55681C) (S/S BY MIL-PRF-55681E)
已确定可靠性的多层固定、未封装陶瓷电介质芯片电容器(取代MIL-C-55681C)的通用规范
1994-07-13
现行
MIL MIL-C-55681D
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-C-55681C) (S/S BY MIL-PRF-55681E)
已确立可靠性的多层固定无封装陶瓷介质片式电容器(取代MIL-C-55681C)(由MIL-PRF-55681E提供)
1994-07-13