표면실장기술－제2부：표면실장부품(SMD)의 운송과 보관조건－적용가이드
表面安装技术第2部分:表面安装器件（SMD）的运输和储存条件应用指南

2009-12-01

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
表面安装技术 - 第2部分:表面安装器件（SMD）的运输和存储条件 - 应用指南

2021-07-16

Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) -- Application guide
表面安装技术第2部分:表面安装器件（SMD）的运输和储存条件应用指南

2009-01-01

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
表面安装技术.第2部分:表面安装装置（SMD）的运输和储存条件.应用指南

2021-07-16

IEC 61760-2. Surface mounting technology. Part 2. Transportation and storage conditions of surface mounting devices (SMD). Application guide
IEC 61760-2 表面安装技术 第二部分 表面安装装置（SMD）的运输和储存条件 申请指南

2005-12-09

Draft Document - Surface mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test (IEC 91/523/CD:2005)
文件草稿.表面安装技术.表面安装焊点的环境和耐久性试验方法.第1-2部分:剪切强度试验（IEC 91/523/CD:2005）

2005-10-01

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 61760-2:2007); German version EN 61760-2:2007
表面安装技术.第2部分:表面安装装置（SMD）的运输和储存条件.应用指南（IEC 61760-2-2007）；德文版EN 61760-2:2007

2007-10-01

Draft Document - Surface mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 91/519/CD:2005)
文件草稿.表面安装技术.表面安装焊点的环境和耐久性试验方法.第1-1部分:抗拉强度试验（IEC 91/519/CD:2005）

2005-10-01

Draft Document - Low ESL measuring method - Part 2: Surface mount capacitors for use in electrical and electronic equipment (IEC 40/1969/CD:2008)
文件草稿.低ESL测量方法.第2部分:电气和电子设备用表面安装电容器（IEC 40/1969/CD:2008）

2009-02-01

Draft Document - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/845/CD:2009)
文件草稿.频率控制和选择用表面安装压电器件.标准轮廓和端子引线连接.第2部分:陶瓷外壳（IEC 49/845/CD:2009）

2009-05-01

Draft Document - Fixed capacitors for use in electronic equipment - Part 22: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 (IEC 40/2030/CD:2009)
文件草稿.电子设备用固定电容器.第22部分:分规范.2级陶瓷介质表面安装多层固定电容器（IEC 40/2030/CD:2009）

2010-03-01

Draft Document - Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste (IEC 91/682/CD:2007)
文件草稿.环境试验.第2-83部分:试验.试验Tf:用无铅焊膏润湿平衡法对表面安装器件（SMD）用电子元件的可焊性试验（IEC 91/682/CD:2007）

2007-09-01