Circuit boards and circuit board assemblies. Design and use-Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
电路板和电路板组件 设计和使用

2021-03-19

Printed boards and printed board assemblies. Design and use-Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
印制板和印制板组件 设计和使用

2019-07-12

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
印制板和印制板组件.设计和使用.第6-2部分:焊盘图案设计.最常见表面安装组件（SMD）的焊盘图案说明

2021-02-04

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
印制板和印制板组件.设计和使用.第6-4部分:版图设计.从版图设计的角度看表面安装组件（SMD）尺寸图的一般要求

2019-05-02

IEC 1188-5-7. Design and use of printed boards and printed board assemblies. Part 5.Sectional design and use requirements. Attachment (land/joint) considerations. Section 7. Components with post (DIP) mounting leads on two sides. 52/578/CD. Components with post (DIP) mounting leads on two sides
IEC 1188-5-7 印制板和印制板组件的设计和使用 第五部分 分段设计和使用要求 附件（土地/联合）注意事项 第七节 两侧带有立柱（DIP）安装引线的组件 52/578/CD 两侧带有立柱（DIP）安装引线的部件

1995-07-12

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019); German version EN IEC 61188-6-4:2019
印制板和印制板组件.设计和使用.第6-4部分:接地图案设计.从接地图案设计的角度看表面安装组件（SMD）尺寸图的一般要求（IEC 61188-6-4-2019）；德文版EN IEC 61188-6-4:2019

2020-04-01