LED封装或LED芯片与需要在特定测量条件下进行测量的传统光源之间存在显著差异。由于没有散热器，仅允许在光学测量中使用短电流脉冲，以避免被测设备显著发热。这些脉冲条件下的读数可转换为最终应用条件下的数值，例如使用相应的数据表信息。大批量生产测试所需的高速测量程序也需要特殊的测量配置。这些建议基于技术报告CIE 127:2007的建议，或者至少可以追溯到这些建议。本报告详细描述了可用于执行高精度测量的测量程序和配置- LED封装和LED芯片上的速度测量。还强调了需要考虑的LED的特定特性（例如，电流和温度对电气和光学特性的依赖性）。该出版物以英文撰写，并附有法文和德文的简短摘要。

There are significant differences between LED packages or LED chips and conventional light sources which require measurements under specific measurement conditions.The absence of a heat sink allows only to use short current pulses for the optical measurements in order to avoid significant heating of the device under test. The readings under these pulsed conditions can be converted into values under the final application conditions e.g. by using the corresponding datasheet information. The high-speed measurement procedures necessary for high-volume production testing require also special measurement configurations. These are based on the recommendations of the Technical Report CIE 127:2007 or should at least be traceable back to these.This report describes in detail the measurement procedures and configurations that can be used to perform high-speed measurements on LED packages and LED chips. Specific properties of LEDs which need to be considered (e.g. current and temperature dependency of electrical and optical properties) are also highlighted.The publication is written in English, with a short summary in French and German.