现行

KS C IEC 62326-4(2021 Confirm)

인쇄회로기판－제4부：층간 배선된 경성 다층 인쇄회로기판－부분규격
印制板第4部分:层间连接刚性多层印制板分规范

2011-07-28

现行

KS C IEC 62326-4(2016 Confirm)

인쇄회로기판－제4부：층간 배선된 경성 다층 인쇄회로기판－부분규격
印制板第4部分:层间连接刚性多层印制板分规范

2011-07-28

现行

UNE-EN 62326-4-1999

PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS. SECTIONAL SPECIFICATION.
印制板 第4部分:带夹层连接的刚性多层印制板 分规范

1999-04-19

现行

GOST IEC 62326-4-2013

Платы печатные. Часть 4. Жесткие многослойные печатные платы с межслойными соединениями. Технические условия
印刷板具有层间连接的刚性多层印刷电路板 剖面规格

2013-11-14

现行

IEC 62326-4-1996

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
印刷电路板 - 第4部分:具有层间连接的刚性多层印刷电路板 - 分段规格

1996-12-19

现行

BS EN 62326-4-1997

Printed boards-Rigid multilayer printed boards with interlayer connections. Sectional specification
印制板 带有夹层连接的刚性多层印制板 分规范

1997-06-15

现行

GB/T 4588.4-2017

刚性多层印制板分规范
Sectional specification for rigid multilayer printed boards

2017-07-31

现行

BS 6221-11-1991

Printed wiring boards-Specification for flex-rigid multilayer printed boards with through connections
印刷线路板 带贯穿连接的挠性-刚性多层印制板规范

1991-08-30

现行

IPC 4101E-WAM1

Specification for Base Materials for Rigid and Multilayer Printed Boards
刚性和多层印制板用基材规范

2020-04-01

现行

GB/T 18335-2001

有贯穿连接的刚挠多层印制板规范
Specification for flex-rigid multilayer printed boards with through connections

2001-03-07

现行

DIN EN 62326-4

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections; sectional specification (IEC 62326-4:1996); German version EN 62326-4:1997
印制板.第4部分:带层间连接的刚性多层印制板；分规范（IEC 62326-4-1996）；德文版EN 62326-4:1997

1997-08-01

现行

BS 123300-2001

System of quality assessment. Sectional specification. Rigid multilayer printed boards
质量评估体系 分规范 刚性多层印制板

2001-12-17

现行

KS C IEC 62326-4-1(2021 Confirm)

인쇄회로기판－제4-1부：층간 배선된 경성 다층 인쇄회로기판－부분규격：성능수준 A, B, C
印制板第4部分:带层间连接的刚性多层印制板分规范第1节:性能详细规范性能等级A、B和C

2011-07-28

现行

KS C IEC 62326-4-1(2016 Confirm)

인쇄회로기판－제4-1부：층간 배선된 경성 다층 인쇄회로기판－부분규격：성능수준 A, B, C
印制板第4部分:层间连接刚性多层印制板分规范第1节:性能详细规范性能等级A、B、C

2011-07-28

现行

UNE-EN 62326-4-1-1999

PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION. SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B, AND C
印制板 第4部分:带层间连接的刚性多层印制板.分规范 第1节:能力详细规范-性能等级A、B和C

1999-03-24

现行

IEC 62326-4-1-1996

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
印刷电路板 - 第4部分:具有层间连接的刚性多层印刷电路板 - 分段规格 - 第1节:能力详细规格性能等级A B和C

1996-12-19

现行

BS EN 62326-4-1-1997

Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification-Capability detail specification. Performance levels, A, B and C
印制板 带有夹层连接的刚性多层印制板 分规范 能力详细说明 绩效等级A、B和C

1997-06-15

现行

SJ 21085-2016

刚性多层印制板用粘结片规范
Specification for bonding sheet use in the fabrication rigid multilayer printed circuit boards

2016-01-19

现行

IPC 4821

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
刚性和多层印制板用嵌入式无源器件电容器材料规范

2006-05-01

现行

IPC 4811

Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
刚性和多层印制板用嵌入式无源器件电阻器材料规范

2008-05-01