SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GI（编织电子玻璃增强材料、聚酰亚胺树脂）（取代MIL-S-13949/13B）（无S/S文件）

1997-08-01

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GI（编织电子玻璃增强材料、聚酰亚胺树脂）（取代MIL-S-13949/13B）（无S/S文件）

1998-11-30

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材GI（编织E玻璃增强、聚酰亚胺树脂）（替代MIL-S-13949/13B）（无S/S文件）

1993-08-06

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/10B) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GI（编织电子玻璃增强材料、聚酰亚胺树脂、耐热、金属包覆或非包覆）（取代MIL-S-13949/10B）（无S/S文件）

1997-08-01

PLASTIC SHEET, LAMINATED, MATERIALS (FOR PRINTED WIRING BOARDS), BASE MATERIAL, AI, ARAMID, WOVEN, MAJORITY POLYIMIDE, RESIN, PREIMPREGNATED (B-STAGE) (NO S/S DOCUMENT)
塑料片 层压 材料（用于印制线路板） 基材 AI 芳纶 机织 大部分聚酰亚胺 树脂 预浸渍（B级）（无S/S文件）

1994-01-25

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料

2005-10-07

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Brominated epoxide non-woven/woven E-glass glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料 加固基材 包覆和未包覆 规定可燃性的包铜溴化环氧无纺/编织E玻璃纤维增强层压板（垂直燃烧试验）

2006-08-31

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/29) (NO S/S DOCUMENT)
基材GC层压印刷线路板（编织E玻璃增强 多数氰酸酯树脂 阻燃 金属包覆或非包覆）（替代MIL-S-13949/29）（无S/S文件）

1993-05-18

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/4C) (NO S/S DOCUMENT)
基材GF层压印刷线路板（编织E玻璃增强 多数双功能环氧树脂 阻燃 金属包覆或未包覆）（替代MIL-S-13949/4C）（无S/S文件）

1993-08-16

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/29) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GC（编织电子玻璃增强材料 多数氰酸酯树脂 阻燃 金属包覆或非包覆）（取代MIL-S-13949/29）（无S/S文件）

1997-08-01

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/4C) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GF（编织电子玻璃增强材料 多数双功能环氧树脂 阻燃 金属包覆或未包覆）（取代MIL-S-13949/4C）（无S/S文件）

1997-08-01

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/29) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GC（编织电子玻璃增强材料 多数氰酸酯树脂 阻燃 金属包覆或非包覆）（取代MIL-S-13949/29）（无S/S文件）

1998-11-30

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/4C) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GF（编织电子玻璃增强材料 多数双功能环氧树脂 阻燃 金属包覆或未包覆）（取代MIL-S-13949/4C）（无S/S文件）

1998-11-30

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/4C) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GF（编织电子玻璃增强材料 多数双功能环氧树脂 阻燃 金属包覆或未包覆）（取代MIL-S-13949/4C）（无S/S文件）

1996-01-26

인쇄 회로 기판 및 기타 연결 구조 재료－제2－7부：동박 및 무동박 보강재－직조 E－유리 섬유 기재 에폭시 수지 동박 적층판,난연성(수직 연소 시험)
印制板和其他互连结构用材料第2－7部分:包覆和不包覆增强基材规定可燃性的环氧编织E玻璃层压板（垂直燃烧试验） 覆铜

2006-12-26

인쇄 회로 기판 및 기타 연결 구조 재료－제2－7부：동박 및 무동박 보강재－직조 E－유리 섬유 기재 에폭시 수지 동박 적층판,난연성(수직 연소 시험)
印制板和其他互连结构用材料第2－7部分:包覆和未包覆增强基材规定可燃性（垂直燃烧试验）覆铜环氧编织E玻璃层压板

2006-12-26

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料

2005-08-24

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad. Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构用材料

2009-06-30

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料

2004-02-16

Материалы для печатных плат и других структур межсоединений. Часть 2-7. Материалы основания армированные фольгированные и нефольгированные. Листы слоистые на основе стеклоткани Е-типа с эпоксидным связующим, нормированной горючести (вертикальный тест горения), фольгированные медью
印刷板和其他互连结构的材料 第2-7部分 加强基材包覆和包覆 环氧树脂E玻璃层压板具有明确的易燃性（垂直燃烧试验） 铜包层