本文件建立了计量指南，用于在机械冲击或跌落事件期间，以电气方式可靠地检测倒装芯片球栅阵列（FCBGA）SMT板组件上的焊点开口。一些现有的行业计量机构没有对测试期间打开的FCBGA焊点进行现场电气监控。他们要么在测试之前或之后依赖电气测试，要么使用效率较低的破坏性物理分析技术，这些技术要么不可靠、成本效益低，要么耗时。在- 现场计量不仅可以监控带有菊花链组件的FCBGA组件，还可以监控带有电源或接地层或等效菊花链测试结构的产品组件。此外，本文件中的计量提供了具有球级分辨率的可靠电气数据，因此无需进一步隔离故障。

This document establishes metrology guidelines to electrically and reliably detect solder joint opens on Flip-Chip Ball Grid Array (FCBGA) SMT board assemblies during the mechanical shock or drop event. Some of the existing industry metrologies do not provide in-situ electrical monitoring of FCBGA solder joint opens during test. They either rely on electrical test before or after the test or use less efficient destructive physical analysis techniques which are either not reliable, cost-effective, or are time consuming. In-situ metrology can monitor not only FCBGA assembly with daisy-chain components but also product components with power or ground planes or equivalent daisy-chain test structures. In addition, the metrology in this document provides reliable electrical data with ball-level resolution, thereby eliminating the need for further fault isolation.