查看样本合金摘要数据表（PDF）自1952年以来，合金摘要一直是世界各地使用的金属和合金材料性能数据的主要参考。这些图表和可加工性、图表和热处理图表和图表。SOMERS LTA铜箔是一种锻造铜箔，可在350华氏度下15分钟内退火至完全柔软状态；它的使用简化了印刷电路的制造（LTA=低温退火）。LTA铜尤其适用于重量高达每平方英尺（0.0014英寸厚）1盎司（含1盎司）的箔材，用于层压到高温电介质基板上。LTA铜箔可在全硬条件下进行处理和层压（至基板），然后在350 F的正常粘合剂（基板）固化期间，将铜退火至全硬状态- 成品印刷电路中所需的软条件。

View Sample Alloy Digest Data Sheet (PDF)Since 1952, Alloy Digest has been the leading reference for materials property data on metals and alloys used throughout the world. Featuring graphs, charts and tables, these sheets give facts and figures on composition or characterization, physical and mechanical properties, heat treatment, and machinability.SOMERS LTA Copper is a wrought copper foil that can be annealed at 350 F in 15 minutes to the full-soft condition; its use simplifies the manufacture of printed circuits (LTA = Low-Temperature Annealable). LTA Copper is especially useful for foil weights up to and including one ounce per square foot (0.0014-inch thick) for laminating to high-temperature dielectric substrates. The LTA copper foil can be handled and laminated (to the substrates) in the full-hard condition, then during the normal adhesive (substrate) cure at 350 F, the copper is annealed to the full-soft condition required in the finished printed circuit.